Kuthiwani ngobuchwepheshe bokwelashwa kwendawo ye- aluminium substrate pcb ku-aluminium substrate aluminium pcb surface ukwenza izinkulumo ezithile.

Ngemuva kokuthi izinto zikagesi zifakiwe ebhodini lesifunda eliphrintiwe, kufanele lithengiswe nge-othomathikhi.Kulezi zinqubo, uma kunento ekhihliza amagwebu, ngaphezu kobuchwepheshe bokuphrinta bebhodi lesifunda obuphrintiwe abunangqondo, kepha futhi buhlobene nokumelana nokucwiliswa kokushisela Ukumelana okungafanele kwe-soldering kwe-aluminium substrate kuholela ekwehlisweni kokuqina kwekhwalithi yohlelo ngokusemandleni, futhi kulimaza ingxenye yonke ngokubi kakhulu.

I-Aluminium substrate iyinto ehlanganisiwe ye-resin, i-aluminium ne-foil foil.I-Resin ne-aluminium, i-coefficient yokwandisa ukushisa kwe-copper ihluke kakhulu, ngakho-ke, ngamandla angaphandle, ngaphansi kokushisa, akhiqiza ukusatshalaliswa okungalingani kwamandla angaphakathi epuleti. Uma ama-molecule wamanzi nolunye udaba oluphansi lwamangqamuzana luhlala kuma-pores we-interface interface, ukucindezeleka okugxilile kuzoba kukhulu ngaphansi kwesimo sokushaqeka okushisayo.

Uma ingcina ihluleka ukumelana nale mikhosi yangaphakathi ebhubhisayo, i-lamination and foaming will occur between the copper foil and the substrate, or between the substrate layers, at the interface interface.Ukuze uthuthukise ukumelana kwe-solder kwe-aluminium substrate, kuyadingeka ukunciphisa Izindlela ezizobhubhisa ukwakheka kwayo yonke imikhakha ekwakheni nasekushiseni okuphezulu kwepuleti.Izindlela zokuthuthuka ikakhulu zibandakanya ukwelashwa okuphezulu kwe-foil yethusi ne-aluminium, ukwenziwa ngcono kokunamathiselwa kwe-resin, kanye nokulawulwa kwengcindezi kanye nokushisa ngenkathi ngokucindezela.

Amandla okubopha we-aluminium interface ngokuvamile anqunywa izingxenye ezimbili:

Okokuqala, i-aluminium base ne-adhesive aluminium base plate processing (i-thermal insulation adhesive main resin noma i-adhesive) amandla okunamathela;

Okwesibili, kungamandla okunamathisela phakathi kokunamathisela nenhlaka.

Uma i-glue ingangena ngaphakathi kwesendlalelo se-aluminium impahla kahle, futhi ukucutshungulwa kwe-aluminium substrate kungaxhunyaniswa ngamakhemikhali ne-resin enkulu, amandla aphezulu e-peel we-aluminium substrate angaqinisekiswa.

Izindlela zokwelashwa ze-Aluminium surface i-oxidation, umdwebo wocingo, njll., Kungokwandiswa kwendawo yokwenza ngcono ukunamathela.Ngokujwayelekile, indawo engaphezulu ye-oxidation inkulu kakhulu kunaleyo yokudweba, kepha i-oxidation uqobo nayo ihluke kakhulu.

Lokhu okungenhla yi-aluminium substrate aluminium surface treatment technology.we singumkhiqizi we-aluminium substrate. Ngiyethemba ukuthi lo mbhalo uzoba usizo kuwe.