Yiziphi izici double ungqimba PCB ibhodi ne-multi-ungqimba wesifunda ibhodi nokuthi ukuze uwahlukanise Ake ulandele? Abahlinzeki PCB ibhodiukuqonda:
Ungqimba Double PCB ibhodi
Amabhodi anezinhlangothi ezimbili anezintambo nhlangothi zombili.Kodwa ukusebenzisa izinhlangothi zombili zocingo, kufanele kube khona ukuxhumana ngogesi okufanele phakathi kwalezi zinhlangothi zombili. Leli "bhuloho" eliphakathi kwamasekethe libizwa nge-hole hole (VIA). imbobo encane ku-PCB, igcwaliswe noma ifakwe insimbi, engaxhunywa ocingweni ezinhlangothini zombili.Ngenxa yokuthi amapaneli aphindwe kabili anendawo ephindwe kabili yendawo yephaneli elilodwa, futhi ngoba izintambo zingaxhunyaniswa (ezingalimala nxazonke elinye icala), lilungele kangcono amasekethe ayinkimbinkimbi kunephaneli elilodwa.
Ngokuzenzakalelayo iphaneli eliphindwe kabili luhlobo lwebhodi lesifunda le-PCB elibaluleke kakhulu, uyinjongo yabakhulu, ukubona ukuthi ibhodi lebhodi le-PCB iphaneli kabili lilula, ukuqonda kwephaneli elilodwa kukholwa ngokuphelele ukuthi abangani bangaqonda, kuyisandiso kwephaneli elilodwa, iphaneli ephindwe kabili isho ulayini wepaneli owodwa owenele ukuya kolunye uhlangothi, iphaneli ephindwe kabili, futhi bekukhona okubalulekile imbobo yomhlahlandlela.Iphuzu elilula ukuthi ulayini onamacala amabili, zombili izinhlangothi zomugqa! Ubakaki uthi: ibhodi lomugqa ohlangothini olubili liyi-double panel! Abanye abangani bazobuza njengebhodi elenziwe ngocingo olunamacala amabili, kodwa uhlangothi olulodwa kuphela olunezingxenye zikagesi, lelo bhodi ngemuva kwakho konke liyi-double panel noma iphaneli elilodwa? Impendulo isobala , Ibhodi elinjalo liyiphaneli elikabili, kumabhodi wamaphaneli aphindwe kabili abekwe ezingxenyeni.
Amabhodi wesifunda ama-multilayer alula ukuhlukanisa
Ibhodi lesifunda ngokusho kokunquma ukuthi ingakanani inqubo yenqubo yokuhlanganisa izintengo nentengo yemishini, ibhodi lesifunda elijwayelekile elinolayini owodwa kanye nomugqa ophindwe kabili, owaziwa njengephaneli elilodwa nephaneli elikabili, imikhiqizo esezingeni eliphakeme ye-elektroniki, noma kunjalo, ngenxa yomklamo wesikhala somkhiqizo izinto , ngaphezu kwentambo ebusweni, istaki sangaphakathi se-multilayer circuit, inqubo yokukhiqiza, yenze ungqimba ngalunye ngemuva kolayini, futhi ngokuma kwendawo yedivayisi, ngokucindezela, vumela ukubekwa kwesekethe yesifunda esiningi ungcezu lwebhodi lesifunda. njengebhodi lesifunda le-multilayer. Noma yiliphi ibhodi lesifunda elikhudlwana noma elilingana nezendlalelo ezi-2 lingabizwa ngebhodi lesifunda lesendlalelo esiningi.Ibhodi lesifunda lesendlalelo esiningi lingase lihlukaniswe ngebhodi lesifunda elinzima elingaphezulu, ungqimba lwamabhodi wesifunda oluthambile nolunzima -layer ibhodi lesifunda elithambile nelilukhuni elihlangene.
Ukuzalwa kwebhodi lesifunda le-multilayer
Ubuningi obukhuphukayo bamaphakeji we-IC buholela ekuxhumaneni okuphezulu kokuhlangana, okudinga ukusetshenziswa kwezindawo ezingaphansi eziningi.Izinkinga zokuklama ezingalindelekile ezifana nomsindo, i-stray capacitance, i-crosstalk ivela ekuhlelweni kwamasekethe aphrintiwe.Ngakho-ke, ukwakhiwa kwe-PCB kumele kuhloswe ngakho ukunciphisa ubude bomugqa wesiginali nokugwema imizila efanayo.Ngokusobala, kuphaneli elilodwa, noma kuphaneli elikabili, lezi zidingo azikwazi ukuphendulwa ngokwanelisayo ngenxa yenani elilinganiselwe lokuwela elingasetshenziswa. Endabeni yenqwaba yokuxhuma nezidingo zokuwela, ungqimba lwebhodi kumele lunwetshwe lube ngaphezu kwezendlalelo ezimbili ukuze kutholakale ukusebenza okugculisayo.Ngakho-ke, inhloso eyinhloko yamabhodi wesekethe amaningi ukunikela inkululeko ethe xaxa yamasekethe kagesi ayinkimbinkimbi kanye / noma anomsindo wokukhetha okufanele izintambo zebhodi yesifunda enezingqimba okungenani ezintathu zokuhambisa, ezimbili zazo zinendawo yangaphandle, futhi ungqimba olusele Ukuxhunywa kukagesi phakathi kwabo kuvame ukwenziwa ngokufaka izimbobo engxenyeni yesiphambano yebhodi lesifunda. Amabhodi wesifunda aphrintiwe amaningi, njengamaphaneli aphindwe kabili, ngokuvamile afakwa ngamapuleti e-orifice ngaphandle kokuthi kuboniswe ngenye indlela.
Ama-multilaminate enziwa ngokufaka izingqimba zamasekethe amabili noma ngaphezulu ngaphezulu komunye nomunye, ngokuxhumeka okunokwethenjelwa okusethwe kusengaphambili phakathi kwawo.Njengoba ukubhola nokuqothula i-electroplating kwenziwa ngaphambi kokuba zonke izingqimba zihlanganiswe ndawonye, le ndlela yephula inqubo yokukhiqiza yendabuko kusukela ekuqaleni Izendlalelo ezimbili zangaphakathi zakhiwa ngamapaneli wendabuko aphindwe kabili, kuyilapho izingqimba zangaphandle zakhiwa ngamapaneli ahlukene.Ngaphambi kokugoqwa, amapuleti angaphakathi azobholwa, afakwe ugesi ngemigodi, adluliswe ngokugqamile, athuthukiswe futhi aqoshwe. ungqimba lomgodi ungqimba lwesiginali, olufakwa ngaphakathi ngendlela yokwakha indandatho yethusi elinganisiwe emphethweni ongaphakathi womgodi. Izendlalelo bese zigoqwa ndawonye zenze ubuningi bezingxenye ezingaphansi komhlaba, ezingaxhunyaniswa i-wave soldering.
Ukuxinana kungenziwa emshinini we-hydraulic noma egumbini lokucindezela ngokweqile (i-autoclave) .Kumshini we-hydraulic, izinto ezilungiselelwe (zezitaki zengcindezi) zifakwa ngaphansi kwengcindezi ebandayo noma esesifudumele (izinto zokushisa okuphezulu kokuguqulwa kwengilazi zifakwa I-170-180 ° C) Izinga lokushisa lengilazi ukushisa lapho isifunda se-amorphous se-polymer (i-resin) noma ingxenye ye-crystalline polymer ishintsha isuka esimweni esinzima, esibuhlungu esiya esimweni se-viscous, esinerabha.
Ama-multilaminate asetshenziswa ezintweni ezikhethekile ze-elekthronikhi (amakhompiyutha, imishini yamasosha), ikakhulukazi ezimweni zesisindo nokugcwala ngokweqile kwevolumu. Noma kunjalo, lokhu kungafinyelelwa ngokwandisa izindleko zama-laminate ukushintshanisa isikhala esiningi nesisindo esincane. ama-circuits wejubane, ama-laminate nawo ayasiza kakhulu njengoba enikeza abaklami bamabhodi wesekethe aphrintiwe anezingqimba ezingaphezu kwamabili zamabhodi zokwenza izintambo futhi ahlinzeka ngezindawo ezinkulu zokubeka phansi namandla.
Lokhu okungenhla kungukuhlukaniswa kwebhodi lesifunda elenziwe , wamukelekile ukubuza mayelana ~
Isikhathi Iposi: Oct-22-2020