I-HDI pcb noma iyiphi ungqimba hdi pcb isivinini sokufaka ukulahleka kokuhlolwa kokuhlolwa enepig | YMSPCB
Yini i-HDI PCB
I-HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.
Izinzuzo ze-HDI PCB
Isizathu esivame kakhulu sokusebenzisa ubuchwepheshe be-HDI ukwanda okuphawulekayo kokuxinana kwamaphakeji. Isikhala esitholwe yizinhlaka zethrekhi enhle siyatholakala ngezingxenye Ngaphandle kwalokho, izidingo zesikhala jikelele ziyancishiswa zizoholela osayizi bamabhodi amancane nezendlalelo ezimbalwa.
Imvamisa i-FPGA noma i-BGA iyatholakala nge-1mm noma isikhala esincane. Ubuchwepheshe be-HDI benza umzila nokuxhumeka kube lula, ikakhulukazi lapho kuhanjiswa phakathi kwezikhonkwane.
I-YMS HDI PCB yokukhiqiza i-capa :
Uhlolojikelele lwamakhono wokukhiqiza we-YMS HDI | |
Isici | amakhono |
Isendlalelo | 4-60L |
Iyatholakala HDI PCB Technology | 1 + N + 1 |
2 + N + 2 | |
3 + N + 3 | |
4 + N + 4 | |
5 + N + 5 | |
Noma yimuphi ungqimba | |
Ubukhulu | 0.3mm-6mm |
Ubuncane bomugqa nobubanzi | 0.05mm / 0.05mm (2mil / 2mil) |
IBGA PITCH | 0.35mm |
Min laser Usayizi yamba | 0.075mm (3nil) |
Min mechanical Usayizi yamba | 0.15mm (6mil) |
Isilinganiselo se-laser hole | 0.9: 1 |
Isilinganiselo se-Aspect for through hole | 16: 1 |
I-Surface Qeda | I-HASL, iholele mahhala i-HASL, i-ENIG, ukucwiliswa kweTin, i-OSP, ukucwiliswa kwesiliva, umunwe wegolide, i-Electroplating Hard Gold, i-OSP ekhethiwe, ENEPIG.etc |
NgeNketho Yokugcwalisa | I-via iyagcotshwa futhi igcwaliswe nge-epoxy eqhubayo noma engeyona eqhuba bese igoqelwa futhi yambozwa ngaphezulu |
Ithusi lagcwaliswa, kwagcwaliswa isiliva | |
I-Laser nge-plated ivaliwe | |
Ukubhalisa | ± 4mil |
Isifihla Solder | Okuluhlaza okotshani, obomvu, ophuzi, ohlaza okwesibhakabhaka, omhlophe, omnyama, onsomi, uMatte Mnyama, uMatte oluhlaza. |