Umgogodla wensimbi enamacala amabili pcb I-Copper Base High Power Metal core Board| I-YMS PCB

Umgogodla wensimbi enamacala amabili pcb I-Copper Base High Power Metal core Board| Isithombe Esifakiwe se-YMS PCB

Incazelo emfushane:

Ihluke nge-MCPCB yesendlalelo Esisodwa, i-MCPCB ezinhlangothi zombili iphinda idinga isinyathelo esingeziwe sokucindezela ukuze uleme i-laminate enesithombe eshisayo kanye nomgogodla wensimbi (owaziwa nangokuthi isisekelo sensimbi) ndawonye. Kodwa ngezinye izikhathi, omunye umthengisi we-Metal Clad eluhlaza uzohlinzeka ngezinto zebhodi esezivele zilamiwe.

amapharamitha

Izendlalelo: 2L

Ukucabanga kwebhodi: 4.5mm

I-Base Material: I-Copper Clad Laminate

Izimbobo ezincane:0.5mm

Ubuncane Bomugqa Ububanzi / Ukususwa: 0.2mm / 0.2mm

Ukususwa okuncane phakathi kwe-Inner Layer PTH ne-Line: 0.2mm

Usayizi: 981mm×85mm

I-aspect ratio:9 :1

ukwelashwa surface: ENIG

Okukhethekile: i-multilayer metal core

Izinhlelo zokusebenza:Iziguquli

Thumela i-imeyli kithi Landa njenge-PDF

umkhiqizo Imininingwane

umkhiqizo Amathegi

Iyini i-Multi Layers MCPCB?

I- Metal Core Printed Circuit Board (MCPCB) , eyaziwa nangokuthi i- PCB eshisayo noma i-PCB esekelwe insimbi, iwuhlobo lwe-PCB enezinto zensimbi njengesisekelo sayo sengxenye yesisakazeli sokushisa sebhodi. Insimbi ewugqinsi (ehlala i-aluminium noma ithusi) ivala uhlangothi olu-1 lwe-PCB. I-Metal core ingaba inkomba yensimbi, ibe phakathi nendawo endaweni ethile noma ngemuva kwebhodi. Injongo yomgogodla we-MCPCB ukuqondisa kabusha ukushisa kude nezingxenye zebhodi ezibalulekile futhi kuya ezindaweni ezingabalulekile kangako njenge-metal heatsink backing noma i-metallic core. Izinsimbi eziyisisekelo ku-MCPCB zisetshenziswa njengenye indlela yamabhodi e-FR4 noma e-CEM3.

Ibhodi lesifunda eliphrintiwe eliwumgogodla wensimbi (MCPCB) elibuye laziwe nge-thermal PCB, lihlanganisa into yensimbi njengesisekelo salo ngokuphambene ne-FR4 evamile, yocezu lwesisababi sokushisa sebhodi. Ukushisa kwakha ngenxa yezingxenye ezithile ze-elekthronikhi ngesikhathi sokusebenza kwebhodi. Inhloso yensimbi ukuguqula lokhu kushisa kude nezingxenye zebhodi ezibucayi futhi kuye ezindaweni ezingabalulekile kangako njenge-metal heatsink backing noma i-metallic core. Ngakho-ke, lawa ma-PCB afanele ukuphathwa kwe-thermal.

Ku-MCPCB yezendlalelo eziningi, izendlalelo zizosatshalaliswa ngokulinganayo ohlangothini ngalunye lwengqikithi yensimbi. Isibonelo, ebhodini elinezingqimba eziyi-12, umgogodla wensimbi uzoba phakathi nendawo enezingqimba ezi-6 phezulu nezingu-6 phansi.

Ama-MCPCB aphinde abizwe ngokuthi yi-insulated metallic substrate (IMS), i-PCB yensimbi engafakwanga (IMPCB), ama-PCB agqoke okushisayo, nama-PCB agqoke insimbi. Kulesi sihloko, sizobe sisebenzisa isifinyezo esithi MCPCB ukugwema ukungaqondakali.

Ama-MCPCB akhiwe ngezingqimba ezivikela ukushisa ezishisayo, amapuleti ensimbi, kanye necwecwe lensimbi lethusi. Eminye imihlahlandlela/izincomo zokuklama kwamabhodi Esifunda Aphrintiwe We-Metal Core (Aluminium Nethusi) iyatholakala uma icelwa; thintana ne-YMSPCB kokuthi kell@ymspcb.com.noma Omele Ukuthengisa ukuze ubuze kabanzi.

I-YMS Multi Layers I-Metal core PCB amakhono okukhiqiza:

Uhlolojikelele lwamakhono okukhiqiza we-YMS Multi Layers Metal PCB
Isici	amakhono
Isendlalelo	1-8L
base Material	I-Aluminium/Copper/Iron Alloy
Ubukhulu	0.8 mm imiz
Uhlamvu lwemali Ukushuba	0.8-3.0mm
Ubuncane bomugqa nobubanzi	0.05mm / 0.05mm (2mil / 2mil)
IBGA PITCH	0.35mm
Imali yokuthengisa ye Min Copper	1.0mm iminithi
Min mechanical Usayizi yamba	0.15mm (6mil)
Isilinganiselo se-Aspect for through hole	16: 1
I-Surface Qeda	I-HASL, iholele mahhala i-HASL, i-ENIG, ukucwiliswa kweTin, i-OSP, ukucwiliswa kwesiliva, umunwe wegolide, i-Electroplating Hard Gold, i-OSP ekhethiwe, ENEPIG.etc
NgeNketho Yokugcwalisa	I-via iyagcotshwa futhi igcwaliswe nge-epoxy eqhuba noma engeyona eye-conductive bese igoqelwa futhi yambozwa ngaphezulu (i-VIPPO)
	Ithusi lagcwaliswa, kwagcwaliswa isiliva
Ukubhalisa	± 4mil
Isifihla Solder	Okuluhlaza okotshani, obomvu, ophuzi, ohlaza okwesibhakabhaka, omhlophe, omnyama, onsomi, uMatte Mnyama, uMatte oluhlaza.

Izizathu eziyinhloko zokusebenzisa amabhodi esisekelo sethusi

1. Ukukhipha ukushisa okuhle:

Njengamanje, amabhodi amaningi we- 2 layer kanye namabhodi amaningi anenzuzo yokuminyana okuphezulu namandla aphezulu, kodwa ukukhishwa kokushisa kunzima ukuba. Izinto eziyisisekelo ze-PCB ezijwayelekile ezifana ne-FR4, i-CEM3 i-conductor empofu yokushisa, ukwahlukanisa kuphakathi kwezendlalelo, futhi ukukhishwa kokushisa akukwazi ukuphuma. Ukushisisa kwendawo yezinto zikagesi akukwazi ukuqedwa kuzoholela ekuhlulekeni kwezinga lokushisa eliphezulu kwezingxenye ze-elekthronikhi. Kodwa ukusebenza okuhle kokukhipha ukushisa kwe-metal core PCB kungaxazulula le nkinga yokukhipha ukushisa.

2. Ukuzinza kwe-Dimensional:

I-Metal core PCB ngokusobala izinzile ngosayizi kunamabhodi aphrintiwe wezinto zokuvikela. Ibhodi le- Aluminium base board kanye ne-aluminium sandwich board iyashisisa ukusuka ku-30℃ kuya ku-140~150℃, usayizi wayo ushintsha ngo-2.5~3.0%.

3. Enye imbangela:

Ibhodi lesisekelo se-Copper linomphumela wokuvikela futhi lithatha indawo ye-substrate ye-ceramic ephukayo, ngakho-ke ingaqiniseka ukusebenzisa ubuchwepheshe bokukhweza phezulu ukuze kuncishiswe indawo yangempela esebenza ngempumelelo ye-PCB. Ibhodi lesisekelo sethusi lithatha indawo yerediyetha nezinye izakhi, lithuthukisa ukumelana nokushisa nokusebenza ngokomzimba kwemikhiqizo futhi linciphisa izindleko zokukhiqiza nezindleko zabasebenzi.