I-China Ceramic PCB I-ceramic eyodwa nezinhlangothi ezimbili I-PCB yenza ama-Ceramic Substrates| YMS PCB ifektri nabakhiqizi | Yongmingsheng
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I-Ceramic PCB ye-ceramic eyodwa nezinhlangothi ezimbili I-PCB yenza ama-Ceramic Substrates| I-YMS PCB

Incazelo emfushane:

I- Y MS isebenza nge-ceramic PCB kanye nezinhlobonhlobo zemikhiqizo ye-PCB,I-Ceramic PCB iyibhodi lesifunda elenziwe ngezinto eziyisisekelo zobumba. Ukulahleka kwe-dielectric ephansi kanye nokulahlekelwa kwe-dielectric; Ukuzinza okuhle kwamakhemikhali; I-coefficient enhle yokwandisa okushisayo kwengxenye

amapharamitha

Izendlalelo: 1Layer Ceramic PCB

I-Base Material: Al2O3(96%)  

Ubukhulu: 1.2mm

Conductor: Ithusi ( Cu )

Izicelo:Imojuli yememori


umkhiqizo Imininingwane

umkhiqizo Amathegi

I-Ceramic PCB: ibhodi lesifunda se-ceramic substrate

I- Ceramic Substrate ichaza ibhodi lenqubo eliyingqayizivele lapho ucwecwe lwe-aluminium yethusi lubambelele ngokuqondile endaweni (uhlangothi olulodwa noma olukabili) lwe-alumina (Al2O3) noma i-aluminium nitride (AlN) engasindi ye-ceramic substrate lapho kushisa. Uma iqhathaniswa ne-FR-4 ejwayelekile noma i-aluminium substrate enesisindo esilula, i-substrate eyinhlanganisela ye-ultra-mncane eyenziwe inamandla akhethekile okufakwa kukagesi, ukuguquguquka okuphezulu kwe-thermal, ukuthengiswa okukhethekile okuthambile kanye nokuqina kwebhondi ephezulu, futhi ingaqoshwa ihluzo eziningi njenge-PCB, kumnandi ekhona lugging ikhono. Ilungele izinto ezinesizukulwane esishisayo (i-LED ekhanya kakhulu, amandla elanga), kanye nokumelana nesimo sezulu esihle kakhulu kungcono kumasethingi angaphandle amabi. I-Ceramic Circuit Board Technology Isingeniso
Kungani usebenzise izinto ze-ceramics ukukhiqiza amabhodi wesifunda? Amabhodi wesifunda se-Ceramic enziwe nge-ceramics kagesi futhi angenziwa ngezindlela ezihlukahlukene. Izici zokumelana nokushisa okuphezulu kanye nokufakwa kukagesi okuphezulu kwamabhodi wesifunda se-ceramic yizona ezivelele kakhulu. Izinzuzo zokungaguquguquki kwe-dielectric ephansi kanye nokulahlekelwa kwe-dielectric, ukuqhutshwa kokushisa okuphezulu, ukuzinza okuhle kwamakhemikhali, kanye ne-coefficient yokwandisa ukushisa okufanayo ezingxenyeni nakho kubalulekile. Ukukhiqizwa kwamabhodi wesifunda se-ceramic kuzosebenzisa ubuchwepheshe be-LAM, okuwubuchwepheshe be-laser quick activation metallization. Asetshenziswa emkhakheni we-LED, amamojula anamandla amakhulu we-semiconductor, iziqandisi ze-semiconductor, ama-heaters kagesi, amasekhethi okulawula amandla, amasekhethi ahlanganisiwe wamandla, izingxenye zamandla ahlakaniphile, izinsiza zamandla ezishintshashintshayo ezihamba phambili, ukudluliselwa kombuso okuqinile, ugesi wezimoto, ukuxhumana, i-aerospace, kanye nezingxenye ze-electronics zempi.
Izinzuzo ze-Ceramic PCB
Ngokungafani ne-FR-4 yendabuko, izinto ze-ceramic zinokusebenza okuhle kwe-high-frequency kanye nokusebenza kukagesi, zine-conductivity ephezulu ye-thermal, ukuqina kwamakhemikhali, ukuqina okuhle kakhulu kwe-thermal, nezinye izakhiwo ezingenayo i-organic substrates. Kuyinto entsha efanelekile yokupakisha ukukhiqizwa kwamasekhethi amakhulu ahlanganisiwe namamojula we-electronic wamandla.
Izinzuzo Main:
Higher conductivity ezishisayo.
Okufanayo okwengeziwe kwe-coefficient yokwandisa okushisayo.
Ibhodi lesifunda lensimbi eliqinile neliphansi le-alumina ceramic.
I-solderability ye-substrate yinhle, futhi izinga lokushisa lokusetshenziswa liphezulu.
I-insulation enhle.
Ukulahleka kwe-high-frequency ephansi.
Ukuhlanganiswa okuphezulu kakhulu kungenzeka.
Ayiqukethe izithako zemvelo, imelana nemisebe ye-cosmic, inokwethenjelwa okuphezulu emkhathini, futhi inempilo ende yesevisi.
Ungqimba lwethusi aluqukethe ungqimba lwe-oxide futhi lungasetshenziswa isikhathi eside endaweni yokunciphisa. Ama-Ceramic PCB angaba wusizo futhi asebenze kahle kumabhodi esekethe aphrintiwe kulezi zimboni nezinye eziningi, kuye ngedizayini yakho nezidingo zokukhiqiza.

I-Ceramic PCB iwuhlobo lokushisa oluqhuba i-ceramic powder kanye ne-organic binder, kanye ne-heat conduction organic ceramic PCB ilungiselelwa ekushiseni okushisayo okungu-9-20W/m. Ngamanye amazwi, i-ceramic PCB iyibhodi lesifunda eliphrintiwe elinesisekelo se-ceramic material, okuyizinto ezithinta ukushisa kakhulu ezifana ne-alumina, i-aluminium nitride, kanye ne-beryllium oxide, engenza umphumela osheshayo ekudluliseni ukushisa kude nezindawo ezishisayo futhi zilahle. phezu kobuso bonke. Ngaphezu kwalokho, i-ceramic PCB yakhiwe ngobuchwepheshe be-LAM, okuwubuchwepheshe obusebenzisa i-laser rapid activation metallization. Ngakho-ke i-ceramic PCB iguquguquka kakhulu engathatha indawo yalo lonke ibhodi lesifunda eliphrintiwe elingokwesiko elinokwakhiwa okungenzima kangako nokusebenza okuthuthukisiwe.

Ngaphandle kwe-  MCPCB , uma ufuna ukusebenzisa i-PCB ekucindezelweni okuphezulu, ukwahlukanisa okuphezulu, imvamisa ephezulu, izinga lokushisa eliphezulu, kanye nemikhiqizo ye-elekthronikhi enokwethenjelwa ephezulu nencane, i-Ceramic PCB izoba yisinqumo sakho esingcono kakhulu.

Kungani i-Ceramic PCB inokusebenza okuhle kakhulu? Ungaba nombono omfushane ngesakhiwo sawo esiyisisekelo futhi uzoqonda.

  • 96% noma 98% Alumina (Al2O3), Aluminium Nitride (ALN), noma i-Beryllium Oxide (BeO)
  • Izinto zamakhondatha: Kubuchwepheshe befilimu emincane, ewugqinsi, kuzoba i-palladium esiliva (AgPd), i-pllladium yegolide (AuPd); Ku-DCB (I-Direct Copper Bonded) kuzoba ithusi kuphela
  • Izinga lokushisa lokufaka isicelo: -55~850C
  • Inani le-thermal conductivity: 24W~28W/mK (Al2O3); 150W~240W/mK ye-ALN , 220~250W/mK ye-BeO;
  • Amandla okucindezela aphezulu: >7,000 N/cm2
  • I-Voltage Yokuhlukana (KV/mm): 15/20/28 ku-0.25mm/0.63mm/1.0mm ngokulandelanayo
  • I-Thermal Expansion Conefficient(ppm/K): 7.4 (ngaphansi kuka-50~200C)

 

i-ceramics enezinhlangothi ezimbili PCB Ceramic PCB

Izinhlobo zama-PCB e-ceramic

1. Ukushisa okuphezulu kwe-ceramic PCB

2. Ukushisa okuphansi kwe-ceramic PCB

3.Thick ifilimu Ceramic PCB

 Amakhono okukhiqiza we-YMS Ceramic PCB:

Uhlolojikelele lwamakhono okukhiqiza we-YMS Ceramic PCB
Isici amakhono
Isendlalelo 1-2L
Impahla Nokuqina I-Al203: 0.15, 0.38,0.5,0.635,1.0,1.5,2.0mm njll.
ISONO: 0.25,0.38,0.5,1.0mm njll.
I-AIN: 0.15, 0.25,0.38,0.5, 1.0mm njll.
I-Thermal conductivity Al203: Min. 24 W/mk kufika ku-30W/mk
ISONO: Min. 85 W/mk kufika ku-100W/mk
AIN: Min. 150 W/mk kufika ku-320 W/mk
I-Al2O3 I-Al2O3 inokukhanya okungcono kakhulu - okuyenza ifanele imikhiqizo ye-LED.
ISONO I-SiN ine-CTE ephansi kakhulu. Ihlanganiswe namandla e-Rapture High ingamelana nokushaqeka okunamandla okushisayo.
I-AlN I-AlN ine-Superior Thermal Conductivity - iyenza ifaneleke izinhlelo zokusebenza zamandla aphezulu kakhulu ezidinga indawo engaphansi eshisayo engcono kakhulu.
Ubukhulu beBhodi 0.25mm-3.0mm
ukujiya kwethusi 0.5-10OZ
Ubuncane bomugqa nobubanzi 0.075mm/0.075mm(3mil/3mil)
Okukhethekile I-Countersink, i-Counterbore drilling.etc.
Min mechanical Usayizi yamba 0.15mm (6mil)
Izinto zama-conductor: Ngobuchwepheshe befilimu ezacile, ewugqinsi, kuzoba i-palladium esiliva (AgPd), igolide pllladium (AuPd), iPlatinum For DCB (Direct Copper Bonded) kuzoba ithusi kuphela.
I-Surface Qeda I-HASL, iholele mahhala i-HASL, i-ENIG, ukucwiliswa kweTin, i-OSP, ukucwiliswa kwesiliva, umunwe wegolide, i-Electroplating Hard Gold, i-OSP ekhethiwe, ENEPIG.etc
Isifihla Solder Okuluhlaza okotshani, obomvu, ophuzi, ohlaza okwesibhakabhaka, omhlophe, omnyama, onsomi, uMatte Mnyama, uMatte oluhlaza.
ephucuziwe Ra <0.1 um
lapped Ra <0.4 um

Funda izindaba ezengeziwe





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