HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Incazelo emfushane:

I-HDI ephrintiwe amabhodi wesekethe offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

amapharamitha

Izinhla: 8

Base Material:FR4 High Tg EM827

Ubukhulu: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Ubuncane Line Ububanzi / Isikhala: 0.10mm / 0.10mm

Ukususwa okuncane phakathi kwe-Inner Layer PTH ne-Line: 0.2mm

Usayizi: 222mm × 120mm

Aspect Ratio：10.6 : 1

ukwelashwa surface: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Izicelo: Computer

Thumela i-imeyli kithi Landa njenge-PDF

umkhiqizo Imininingwane

Imibuzo Evame Ukubuzwa

umkhiqizo Amathegi

I-HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI IBhodi inqubo ukukhiqizwa:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

On wonke, inqubo ukukhiqizwa HDI ipuleti sinzima, okuyinto kufanele ligcwaliswe emva izikhathi eziningi ukukhiqizwa isikhathi eside. Kuyinto izidingo okusezingeni eliphezulu nokunemba kanye ukuncipha ukulawula kusendlalelo ngasinye, kodwa futhi izindinganiso eziphakeme izinto, imishini, indawo kanye nabasebenzi lobuchwepheshe hhayi kuphela.

YMS HDI PCB manufacturing capabilities:

Uhlolojikelele lwamakhono wokukhiqiza we-YMS HDI
Isici	amakhono
Isendlalelo	4-60L
Iyatholakala HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Noma yimuphi ungqimba
Ubukhulu	0.3mm-6mm
Ubuncane bomugqa nobubanzi	0.05mm / 0.05mm (2mil / 2mil)
IBGA PITCH	0.35mm
Min laser Usayizi yamba	0.075mm (3nil)
Min mechanical Usayizi yamba	0.15mm (6mil)
Isilinganiselo se-laser hole	0.9: 1
Isilinganiselo se-Aspect for through hole	16: 1
I-Surface Qeda	I-HASL, iholele mahhala i-HASL, i-ENIG, ukucwiliswa kweTin, i-OSP, ukucwiliswa kwesiliva, umunwe wegolide, i-Electroplating Hard Gold, i-OSP ekhethiwe, ENEPIG.etc
NgeNketho Yokugcwalisa	I-via iyagcotshwa futhi igcwaliswe nge-epoxy eqhubayo noma engeyona eqhuba bese igoqelwa futhi yambozwa ngaphezulu
	Ithusi lagcwaliswa, kwagcwaliswa isiliva
	I-Laser nge-plated ivaliwe
Ukubhalisa	± 4mil
Isifihla Solder	Okuluhlaza okotshani, obomvu, ophuzi, ohlaza okwesibhakabhaka, omhlophe, omnyama, onsomi, uMatte Mnyama, uMatte oluhlaza.