High Tg material PCB 6 Layer High Tg Board| YMS PCB

Incazelo emfushane:

High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG nomkhiqizi PCB , look no further. You can use YMS technology to design your high TG PCB boards.

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Layers: 6L High Tg FR4 Material Ukucabanga Kwebhodi: 1.6mm Base Material:EM827 High tg Imigodi Emincane: 0.2mm Ubuncane Bomugqa Ububanzi / Ukususwa: 0.075mm / 0.075mm Ukususwa okuncane phakathi kwe-Inner Layer PTH kuye kulayini: 0.2mm Size：214mm×148mm Ukubukeka kwesilinganiselo 8: 1 ukwelashwa surface: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Isici	amakhono
Isendlalelo	3-60L
Iyatholakala Multilayer PCB Technology	Ngembobo nge-Aspect Ratio 16: 1
	wangcwatshwa futhi uyimpumputhe nge
	Inhlanganisela	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Ubukhulu	0.3mm-8mm
Ubuncane bomugqa nobubanzi	0.05mm / 0.05mm (2mil / 2mil)
IBGA PITCH	0.35mm
Min mechanical Usayizi yamba	0.15mm (6mil)
Isilinganiselo se-Aspect for through hole	16: 1
I-Surface Qeda	I-HASL, iholele mahhala i-HASL, i-ENIG, ukucwiliswa kweTin, i-OSP, ukucwiliswa kwesiliva, umunwe wegolide, i-Electroplating Hard Gold, i-OSP ekhethiwe, ENEPIG.etc
NgeNketho Yokugcwalisa	I-via iyagcotshwa futhi igcwaliswe nge-epoxy eqhuba noma engeyona eye-conductive bese igoqelwa futhi yambozwa ngaphezulu (i-VIPPO)
	Ithusi lagcwaliswa, kwagcwaliswa isiliva
Ukubhalisa	± 4mil
Isifihla Solder	Okuluhlaza okotshani, obomvu, ophuzi, ohlaza okwesibhakabhaka, omhlophe, omnyama, onsomi, uMatte Mnyama, uMatte oluhlaza.