imọ Ìwé | ibi-ipele | kekere ipele | ayẹwo | ||
mimọ elo | FR4 | deede TG | Shengyi S1141, KB6160, Huazhen H140 (ko dara fun asiwaju free ilana) | ||
arin TG | Fun HDI, ti ọpọlọpọ fẹlẹfẹlẹ: ki o S1000H, ITEQIT158, HuazhengH150; TU-662; | ||||
ga TG | Fun nipọn Ejò, ga Layer: ki o S1000-2; ITEQIT180A; HuazhengH170; ISOLA: FR408R; 370HR; TU-752; | ||||
Halogen ọfẹ | Arin TG: ki o S1150G, HuazhengH150HF, H160HF; ga TG: ki o S1165 | ||||
ga CTI | CTI≥600 ki o S1600, Huazheng H1600HF, H1600A; | ||||
ga Igbohunsafẹfẹ | Rogers, Arlon, Taconic, ki o SCGA-500, S7136; HuazhengH5000 | ||||
Ere giga | Ki o S7439; TU-862HF, TU-872SLK; ISOLA: Mo-Speed, Mo-Tera @ MT40; Huazheng: H175, H180, H380 | ||||
Flex elo | mimọ | Pọ-free: Dupont AK XingyangW-Iru, Panosonic RF-775; | |||
Coverlay | Ki o SF305C, Xingyang Q-Iru | ||||
PP pataki | Ko si sisan PP: VT-447LF, Taiguang 370BL Arlon 49N | ||||
Seramiki kún alemora dì: Rogers4450F | |||||
Ptfe alemora dì: Arlon6700, Taconic FR-27 / FR-28 | |||||
Double-apa coatingPI: xingyang N-1010TF-MB | |||||
irin Mimọ | Berguist Al-mimọ, Huazheng Al-mimọ, chaosun Al-mimọ, copperbase | ||||
Pataki | Ga ooru resistance rigidity PI: Tenghui VT-901, Arlon 85N, ki o S260 (Tg250) | ||||
Ga gbona iba ina elekitiriki ohun elo ti: 92ML | |||||
Funfun seramiki ohun elo ti: alumina seramiki, Aluminiomu nitride amọ | |||||
BT ohun elo ti: Taiwan Nanya NGP-200WT | |||||
fẹlẹfẹlẹ | FR4 | 36 | 60 | 140 | |
Kosemi & Flex / (Flex) | 16 (6) | 16 (6) | 24 (6) | ||
Ga Igbohunsafẹfẹ ADALU Lamination | 12 | 12 | 20 | ||
100% ptfe | 6 | 6 | 10 | ||
HDI | 2 igbesẹ | 3 igbesẹ | 4 igbesẹ |
imọ Atọka | ibi-ipele | kekere ipele | ayẹwo | ||
ifijiṣẹ Iwon | Max (mm) | 460 * 560 | 460 * 560 | 550 * 900 | |
(Mm) | Min (mm) | 20 * 20 | 10 * 10 | 5 * 10 | |
Iwọn / Gap | Akojọpọ (mil) | 0.5OZ mimọ Ejò: 3/3 1.0OZ mimọ Ejò: 4/4 2.0OZ mimọ Ejò: 5/6 | |||
3.0OZ mimọ Ejò: 7/9 4.0OZ mimọ Ejò: 8/12 5.0OZ mimọ Ejò: 10/15 | |||||
6.0OZ mimọ Ejò: 12/18 10 iwon mimọ Ejò: 18/24 12 iwon mimọ Ejò: 20/28 | |||||
Lode (mil) | 1 / 3OZ mimọ Ejò: 3/3 0.5OZ mimọ Ejò: 4/4 1.0OZ mimọ Ejò: 5/5 | ||||
2.0OZ mimọ Ejò: 6/8 3.0OZ mimọ Ejò: 7/10 4.0OZ mimọ Ejò: 8/13 | |||||
5.0OZ mimọ Ejò: 10/16 6.0OZ mimọ Ejò: 12/18 10 iwon mimọ Ejò: 18/24 | |||||
12 iwon mimọ Ejò: 20/28 15 iwon mimọ Ejò: 24/32 | |||||
Line iwọn ifarada | > 5.0 mil | ± 20% | ± 20% | ± 1.0mil | |
≤5.0 mil | ± 1.0mil | ± 1.0mil | ± 1.0mil | ||
liluho | Min lesa (mm) | 0.1 | 0.1 | 0.1 | |
Min CNC (mm) | 0.2 | 0.15 | 0.15 | ||
Max CNC lu bit (mm) | 6.5 | 6.5 | 6.5 | ||
Min Half Iho (mm) | 0,5 | 0,4 | 0,4 | ||
PTH Iho (mm) | deede | ± 0.1 | ± 0,075 | ± 0,075 | |
titẹ iho | ± 0.05 | ± 0.05 | ± 0.05 | ||
Iho Angle (conical) | Iwọn ti oke diameter≤6.5mm: 800,900,1000,1100; iwọn ti oke diameter≥6.5mm: 900; | ||||
Konge of Ijinle-Iṣakoso liluho (mm) | ± 0.10 | ± 0,075 | ± 0.05 | ||
Nọmba ti afọju CNC ihò ti ọkan ẹgbẹ | .2 | .3 | .4 | ||
Kere nipasẹ iho aye (ti o yatọ si nẹtiwọki, ologun, egbogi, mọto) mm | 0,5 | 0,45 | 0,4 | ||
Kere nipasẹ iho aye (ti o yatọ si nẹtiwọki, gbogbo ise Iṣakoso ati olumulo ẹrọ itanna) mm | 0,4 | 0.35 | 0.3 |
imọ Ìwé | ibi-ipele | kekere ipele | ayẹwo | ||
liluho | Awọn kere iho odi aye ti awọn lori iho (kanna nẹtiwọki mm) | 0.2 | 0.2 | 0.15 | |
Kere iho odi aye (mm) fun ẹrọ ihò | 0.8 | 0,7 | 0,7 | ||
Awọn kere ijinna lati via iho si ni akojọpọ Ejò tabi ila | 0.2 | 0.18 | L10L: 0,15 | ||
> 10L: 0.18 | |||||
Awọn min ijinna lati Device iho to akojọpọ Ejò tabi ila | 0.3 | 0,27 | 0,25 | ||
Welding Oruka | nipasẹ iho | 4 (HDI 3mil) | 3.5 (HDI 3mil) | 3 | |
(Mil) | paati iho | 8 | 6 | 6 | |
Dam Solder (mil) | (Solder boju) | 5 | 4 | 4 | |
(Arabara) | 6 | 5 | 5 | ||
Ik Board Sisanra | > 1.0 mm | ± 10% | ± 8% | ± 8% | |
≤1.0 mm | ± 0.1mm | ± 0.1mm | ± 0.1mm | ||
Board sisanra (mm) | 0,5-5,0 | 0.4-6.5 | 0.3-11.5 | ||
Board sisanra / lu bit | 10:01:00 | 12:01:00 | 13:01:00 | ||
Nipasẹ iho (lu bit) plug iho (plug solder) | 0.25-0.5mm | 0.20-0.5mm | 0.15-0.6mm | ||
Afọju sin iho, iho inu pad | 0.25-0.5mm | 0.20-0.5mm | 0.10-0.6mm | ||
Teriba ati lilọ | ≤0.75% | ≤0.75% | ≤0.5% | ||
ikọjujasi Iṣakoso | ≥5.0mil | ± 10% | ± 10% | ± 8% | |
<5.0mil | ± 10% | ± 10% | ± 10% | ||
CNC | elegbegbe ifarada (mm) | ± 0.15 | ± 0.10 | ± 0.10 | |
V-ge ifarada ti péye sisanra (mm) | ± 0.15 | ± 0.10 | ± 0.10 | ||
Afisona Iho (mm) | ± 0.15 | ± 0.10 | ± 0.10 | ||
Konge of dari jin milling (mm) | ± 0.15 | ± 0.10 | ± 0.10 |
imọ Ìwé | ibi-ipele | kekere ipele | ayẹwo | ||
elegbegbe | bevel eti | 20 ~ 60 ìyí; ± 5degree | |||
dada itọju | immersion wura | Ni sisanra (bulọọgi inch) | 118-236 | 118-236 | 118-236 |
Max wura (uinch) | 3 | 3 | 6 | ||
Lile wura (Au nipọn) | Gold ika (uinch) | 15 | 30 | 60 | |
NiPdAu | NI (uinch) | 118-236 | |||
PA (uinch) | 2-5 | ||||
Au (uinch) | 1-5 | ||||
Awonya ina wura | NI (uinch) | 120-400 | |||
AU (uinch) | 1-3 | ||||
immersion tin | Tin (um) | 0.8-1.2 | |||
immersion Ag | Ag (uinch) | 6-10 | |||
OSP | nipọn (um) | 0.2-0.5 | |||
Hal / Hal LF | BGApad (mm) | ≥0.3 × 0.3 | |||
sisanra (mm) | 0.6≤H≤.0.0 | ||||
Board sisanra vs iho opin | Tẹ hole≤3: 1 | ||||
Tin (um) | 2.0-40.0 | ||||
Kosemi & Flex | O pọju aisi-itanna sisanra ti Flex | Pọ -Free 25um | Pọ-free 75um | Pọ-free75um | |
Flex ara iwọn (mm) | ≥10 | .5 | .5 | ||
Max ifijiṣẹ iwọn (mm) | 200 × 400 | 200 × 500 | 400 × 550 | ||
ijinna ti nipasẹ iho to eti ti kosemi & Flex (mm) | ≥1.2 | ≥1.0 | ≥0.8 | ||
(Mm) ijinna ti irinše iho si awọn eti ti R & F | .51.5 | ≥1.2 | ≥1.0 | ||
imọ Ìwé | ibi-ipele | kekere ipele | ayẹwo | ||
Kosemi & Flex | be | Awọn lode Layer be ti Flex apakan, awọn PI iranlọwọ be ati awọn Iyapa be | Aluminiomu orisun kosemi Flex, kosemi Flex HDI, apapo, ti itanna shielding film | ||
Tech pataki | Back liluho PCB, irin ipanu, nipọn Ejò sin afọju iho, igbese Iho, disiki iho, idaji iho, adalu lamination | Sin se mojuto PCB | Sin kapasito / resistor, ifibọ Ejò ni apa agbegbe, 100% seramiki PCB, sin riveting nut PCB, embedded irinše PCB |
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