HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Kukuru Apejuwe:

HDI tejede Circuit lọọgan offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

sile

Fẹlẹfẹlẹ: 8

Base Material:FR4 High Tg EM827

Sisanra: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Kere Line iwọn / Space: 0.10mm / 0.10mm

Iyatọ Kere laarin Layer Inner PTH ati Laini ： 0.2mm

Iwọn: 222mm x 120mm

Aspect Ratio：10.6 : 1

Dada itọju: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Ohun elo: Computer

Fi imeeli ranṣẹ si wa Gba bi PDF

ọja Apejuwe

Ibeere

ọja Tags

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board gbóògì ilana:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Lori gbogbo, isejade ilana ti HDI awo ni eka, eyi ti o nilo lati wa ni pari lẹhin ọpọlọpọ igba ti gbóògì fun igba pipẹ. O ni ko nikan ga awọn ibeere fun awọn išedede ati shrinkage Iṣakoso ti kọọkan Layer, sugbon tun ga awọn ajohunše ni ohun elo, ẹrọ, ayika ati imọ eniyan.

YMS HDI PCB manufacturing capabilities:

Akopọ awọn agbara iṣelọpọ ẹrọ YMS HDI PCB
Ẹya	awọn agbara
Ika Layer	4-60L
Imọ-ẹrọ PCB HDI ti o wa	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Layer eyikeyi
Sisanra	0.3mm-6mm
Iwọn ati Iwọn ila kekere	0.05mm / 0.05mm (2mil / 2mil)
BGA Agbo	0.35mm
Min lesa ti gbẹ iho Iwon	0.075mm (3nil)
Min darí ti gbẹ iho Iwon	0.15mm (6mil)
Ipele ipin fun iho lesa	0.9: 1
Ipele Ipele fun nipasẹ iho	16: 1
Ipari dada	HASL, Ṣiṣakoso HASL, ENIG, Tin immersion, OSP, Fadaka Imimimọ, Ika Goolu, Itanna Gold Giladi, Aṣayan OSP ， ENEPIG.etc.
Nipasẹ Kun Aṣayan	O ti wa ni palara ati ki o kun pẹlu boya ifọnọhan tabi iposii ti ko ni ifọnọhan lẹhinna tan ati ki o fi sii
	Ejò kun, fadaka kun
	Lesa nipasẹ idẹ ti pa
Iforukọsilẹ	M 4mil
Boju Solder	Green, Red, Yellow, Blue, White, Black, Purple, Black Matte, Matte green.etc.