I-Bendable, iBhodi yeeSekethe eziGuquguqukayo ezi-2 | YMSPCB

I-Flexible Material Slicing

Uninzi lwezixhobo zebhodi ezibhetyebhetye ziyifomathi eqengqelekayo.Kufuneka ezahlukeneyo, abavelisi kufuneka baphucule ukusetyenziswa.Inyathelo lokuqala ekwenzeni i-FPC kukusika imathiriyeli ebhetyebhetye ukuya kubungakanani bokusebenza.Ukwenziwa kwe-Roll-to-roll isetyenziselwa i-FPC eveliswe ngobuninzi kwaye emva koko inkqubo yokusika inokupheliswa.

Yintoni i-flexible PCB stiffener?

Injongo ye-stiffener kukuqinisa amandla omatshini we-FPC ( yesekethe eguqukayo) kwi-akhawunti yokuququzelela ukunyuswa kwamacandelo kwi-PCB surface, njl njl. iimfuno zemveliso, ezifana ne-PET, i-PI, i-adhesive, isinyithi okanye i-resin stiffener, njl.

I-Flexible PCB s (FPC) zii-PCB ezinokugotywa okanye zijijwe ngaphandle kokonakalisa iisekethe, okuthetha ukuba iibhodi zinokugotywa ngokukhululekileyo ukuze zihambelane nemilo efunekayo ngexesha lokufaka izicelo. Izinto eziphathekayo i-substrate esetyenzisiweyo iguquguqukayo, njengePolyamide, i-PEEK, okanye ifilimu ye-polyester eqhubayo. Kwiimeko ezininzi, iisekethe ze-flexible zenziwe nge-polyimide okanye i-polymer efanayo. Esi sixhobo sichitha ubushushu ngcono kunezixhobo ezininzi zebhodi yesekethe engqongqo. Ngesi sizathu, iisekethe eziguquguqukayo zinokubekwa kwiindawo ezingafanelekanga apho ubushushu bunokuchaphazela ukusebenza kwebhodi yesekethe eqinileyo. Iibhodi zeesekethe eziguquguqukayo zinokuyilwa ukuba zimelane namaqondo obushushu agqithisileyo - phakathi kwe -200 ° C kunye ne-400 ° C - echaza ukuba kutheni zinqweneleka kakhulu kwimilinganiselo ye-borehole kwishishini leoli negesi.

Enyanisweni, ngenxa yale miqathango, kunye nesidingo sezixhobo ezincinci, ezingabonakaliyo kwiindawo ezininzi zemizi-mveliso, iisekethe eziguquguqukayo zimela ukhetho lokuqala loyilo lobunjineli kwi-teknoloji ye-sensor ye-industrial.

Ukumelana nobushushu obuphezulu kuza ngokuqhelekileyo kuza nokuxhathisa okulungileyo kweekhemikhali kunye nokumelana okugqwesileyo kwimitha kunye nokuvezwa kwe-UV ngokunjalo. Idityaniswe nokukwazi ukulawula i-impedances kwi-high-density circuit board designs, uyilo lwesekethe oluguquguqukayo lubonelela ngeenzuzo ezininzi kubavelisi.