HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Qisqa Tasvir:

HDI bosilgan elektron platalar offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parameters

Qatlamlari: 8

Base Material:FR4 High Tg EM827

Qalinligi: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimal chiziq kengligi / tipi: 0.10mm / 0.10mm

Ichki qatlam PTH va chiziq orasidagi minimal bo'shliq: 0,2 mm

Hajmi: 222mm × 120mm

Aspect Ratio：10.6 : 1

Er ishlash: beradi EniG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Ilovalar: Kompyuter

Bizga elektron pochta yuborish PDF sifatida yuklab

Mahsulot batafsil

Tss

Mahsulot teglar

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

O'zTTBRM kengashi ishlab chiqarish jarayoni:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Umuman olganda, Inson taraqqiyoti indeksi plastinka ishlab chiqarish jarayoni uzoq vaqt davomida ishlab chiqarish bir necha marta so'ng nihoyasiga kerak bo'lgan, murakkab. Bu nafaqat har bir qatlami aniqligi va siqilish nazorat qilish uchun yuqori talablar, balki materiallar, asbob-uskunalar, atrof-muhit va texnik xodimlar ham yuqori standartlar ekan.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB ishlab chiqarish imkoniyatlariga umumiy nuqtai
Xususiyat	imkoniyatlar
Qatlamlarni hisoblash	4-60L
Mavjud HDI PCB texnologiyasi	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Har qanday qatlam
Qalinligi	0,3 mm-6 mm
Minimal chiziq kengligi va bo'sh joy	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PITCH	0,35 mm
Minimal lazerli burg'ulash hajmi	0,075 mm (3 nil)
Eng kam mexanik burg'ulash hajmi	0,15 mm (6 mil)
Lazer teshigi uchun nisbati	0.9: 1
Teshikning nisbati	16: 1
Yuzaki tugatish	HASL, qo'rg'oshinsiz HASL, ENIG, immersion qalay, OSP, immersion kumush, oltin barmoq, elektrokaplama qattiq oltin, selektiv OSP ， ENEPIG.etc.
To'ldirish opsiyasi orqali	Orqali qoplanadi va o'tkazuvchan yoki o'tkazmaydigan epoksi bilan to'ldiriladi, so'ngra yopiladi va qoplanadi
	Mis bilan to'ldirilgan, kumush bilan to'ldirilgan
	Mis bilan qoplangan lazer yordamida yopish
Ro'yxatdan o'tish	± 4 mil
Lehim maskasi	Yashil, qizil, sariq, moviy, oq, qora, binafsha, mat qora, mat yashil va boshqalar.