Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in tenglikni ishlab chiqarish .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Bosma elektron plataga kirish
Oddiy bosilgan elektron plata: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Oddiy PCB ishlab chiqarish qobiliyatlari:
YMS Oddiy PCB ishlab chiqarish imkoniyatlariga umumiy nuqtai | ||
Xususiyat | imkoniyatlar | |
Qatlamlarni hisoblash | 1-60 l | |
Oddiy tenglikni texnologiyasi mavjud | 16: 1 nisbati bilan teshik orqali | |
ko'milgan va ko'r orqali | ||
Gibrid | RO4350B va FR4 Mix va boshqalar kabi yuqori chastotali materiallar. | |
M7NE va FR4 Mix va boshqalar kabi yuqori tezlikli material. | ||
Materiallar | CEM- | CEM-1; CEM-2, CEM-4, CEM-5. va boshqalar |
FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G va boshqalar. | |
Yuqori tezlik | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 seriyalari, MW4000, MW2000, TU933 va boshqalar. | |
Oliy Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 va boshqalar. | |
Boshqalar | Polimid, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, keramika asosidagi va boshqalar. | |
Qalinligi | 0,3 mm-8 mm | |
Mis qalinligi | 10 oz | |
Minimal chiziq kengligi va bo'sh joy | 0,05 mm / 0,05 mm (2 mil / 2 mil) | |
BGA PITCH | 0,35 mm | |
Eng kam mexanik burg'ulash hajmi | 0,15 mm (6 mil) | |
Teshikning nisbati | 16: 1 | |
Yuzaki tugatish | HASL, qo'rg'oshinsiz HASL, ENIG, immersion qalay, OSP, immersion kumush, oltin barmoq, elektrokaplama qattiq oltin, selektiv OSP , ENEPIG.etc. | |
To'ldirish opsiyasi orqali | Orqali qoplanadi va o'tkazuvchan yoki o'tkazmaydigan epoksi bilan to'ldiriladi, so'ngra yopiladi va qoplanadi (VIPPO) | |
Mis bilan to'ldirilgan, kumush bilan to'ldirilgan | ||
Ro'yxatdan o'tish | ± 4 mil | |
Lehim maskasi | Yashil, qizil, sariq, moviy, oq, qora, binafsha, mat qora, mat yashil va boshqalar. |
Kabi bo'lishi mumkin:
1, elektron kengashi payvandlash ham e'tibor muhtoj masalalarni qisqacha
4、Yalang'och taxtani sinovdan o'tkazish nima?