HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Kısa Açıklama:

HDI baskılı devre kartları offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parametreler

Katmanlar: 8

Base Material:FR4 High Tg EM827

Kalınlık: 1.6 ± 0,10

Min.Hole Size：0.15mm

Asgari Çizgi Genişliği / Uzay: 0,10 / 0,10

İç Katman PTH ile Çizgi ： 0.2mm arasındaki Minimum Açıklık

Boyutu: 222mm x 120mm

Aspect Ratio：10.6 : 1

Yüzey işleme: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Uygulamalar: Bilgisayar

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Ürün ayrıntısı

SSS

Ürün etiketleri

HDI PCB'si is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Kurulu üretim süreci:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Bütün olarak bakıldığında, HDI plakasının üretim süreci uzun süre üretim defalarca sonra tamamlanması gerekiyor ki, karmaşıktır. Bu sadece her katmanın doğruluk ve büzülme kontrolü için yüksek gereksinimleri değil, aynı zamanda malzemeleri, teçhizat, çevre ve teknik personel yüksek standartlar var.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB üretim yeteneklerine genel bakış
Özellik	yetenekler
Katman Sayısı	4-60L
Mevcut HDI PCB Teknolojisi	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Herhangi bir katman
Kalınlık	0.3 mm - 6 mm
Minimum çizgi Genişliği ve Boşluğu	0.05mm / 0.05mm (2mil / 2mil)
BGA SAHNE	0,35 mm
Min lazer Delinmiş Boyut	0,075 mm (3nil)
Min mekanik Delinmiş Boyut	0.15 mm (6mil)
Lazer deliği için En Boy Oranı	0.9: 1
Açık delik için En Boy Oranı	16: 1
Yüzey	HASL, Kurşunsuz HASL, ENIG, Daldırma Kalay, OSP, Daldırma Gümüş, Altın Parmak, Elektrokaplama Sert Altın, Seçici OSP ， ENEPIG.etc.
Doldurma Seçeneği ile	Yol kaplanır ve iletken veya iletken olmayan epoksi ile doldurulur, ardından kapatılır ve kaplanır
	Bakır dolgulu, gümüş dolgulu
	Bakır kaplamalı kapak üzerinden lazer
Kayıt	± 4mil
Lehim maskesi	Yeşil, Kırmızı, Sarı, Mavi, Beyaz, Siyah, Mor, Mat Siyah, Mat yeşil.etc.