Top Suppliers Heavy Copper Pcb - OEM Customized 4 Layer Hdi Impedance Blood Glucose Meter Pcb Fr4 Circuit Board – Yongmingsheng

Our well-equipped facilities and great good quality regulate throughout all stages of manufacturing enables us to guarantee total buyer gratification for OEM Customized 4 Layer Hdi Impedance Blood Glucose Meter Pcb Fr4 Circuit Board, Adhering to your small business principle of mutual positive aspects, we have now won superior popularity among our customers because of our best solutions, excellent products and competitive selling prices. We warmly welcome clients from your home and overseas to cooperate with us for common achievement.
Our well-equipped facilities and great good quality regulate throughout all stages of manufacturing enables us to guarantee total buyer gratification for Blood Glucose Meter Pcb, Fr4 Circuit Board, Hdi Impedance Pcb, Make sure you seriously feel free to send us your requirements and we are going to respond to you asap. Now we have got a experienced engineering group to serve for your just about every detailed needs. Cost-free samples could be sent in your case personally to understand much more information. In an effort to meet your requires, be sure to seriously feel free to make contact with us. You may send us emails and contact us directly. Moreover, we welcome visits to our factory from around the globe for much better recognizing of our organization. nd things. In our trade with merchants of numerous countries, we usually adhere for the principle of equality and mutual benefit. It is actually our hope to market, by joint efforts, each trade and friendship to our mutual advantage. We look forward to getting your inquiries.
HDI Board production process:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

On the whole, the production process of HDI plate is complex, which needs to be completed after many times of production for a long time. It’s not only high requirements for the accuracy and shrinkage control of each layer, but also high standards in materials, equipment, environment and technical personnel.