HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Maikling Paglalarawan:

HDI printed circuit boards offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Mga parameter

Layer: 8

Base Material:FR4 High Tg EM827

Kapal: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimum Line Lapad / Space: 0.10mm / 0.10mm

Minimum na Pag-clear sa pagitan ng Inner Layer PTH at Line ： 0.2mm

Laki: 222mm × 120mm

Aspect Ratio：10.6 : 1

Ibabaw ng paggamot: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Mga Application: Computer

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Detalye ng Produkto

Mga Madalas Itanong

produkto Mga Tag

Ang HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Lupon ng produksyon na proseso:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Sa kabuuan, ang produksyon proseso ng HDI plate ay mahirap unawain, na kung saan ay kailangang makumpleto matapos ang maraming oras ng produksyon para sa isang mahabang panahon. Ito ay hindi lamang ang mataas na mga kinakailangan para sa katumpakan at pag-ikli ng kontrol ng bawat layer, ngunit din mataas na pamantayan sa mga materyales, kagamitan, kapaligiran at teknikal na mga tauhan.

YMS HDI PCB manufacturing capabilities:

Pangkalahatang-ideya ng mga kakayahan sa pagmamanupaktura ng YMS HDI PCB
Tampok	mga kakayahan
Bilang ng Layer	4-60L
Magagamit na Teknolohiya ng HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Anumang layer
Kapal	0.3mm-6mm
Minimum na linya ng Lapad at Puwang	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min Laki ng Drilling na Sukat	0.075mm (3nil)
Min na Laki ng mekanikal na Drilled	0.15mm (6mil)
Aspect Ratio para sa butas ng laser	0.9: 1
Aspect Ratio para sa pamamagitan ng butas	16: 1
Tapos na sa Labas	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Sa pamamagitan ng Pagpipilian ng Punan	Ang via ay pinahiran at pinuno ng alinman sa kondaktibo o di-kondaktibong epoxy pagkatapos ay naka-cap at naipahiran
	Puno ng tanso, puno ng pilak
	Laser sa pamamagitan ng tanso na tubog sarado
Pagpaparehistro	± 4mil
Panghinang Mask	Green, Pula, Dilaw, Asul, Puti, Itim, Lila, Matte Itim, Matte berde. Atbp.