Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in pagmamanupaktura ng PCB.
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Naka-print na Lupon ng Lupon ng Linya
Normal na Printed Circuit Board: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Karaniwang mga kakayahan sa pagmamanupaktura ng PCB:
| YMS Karaniwang pangkalahatang kakayahan sa pagmamanupaktura ng PCB | ||
| Tampok | mga kakayahan | |
| Bilang ng Layer | 1-60L | |
| Magagamit na Karaniwang Teknolohiya ng PCB | Sa pamamagitan ng butas na may Aspect Ratio 16: 1 | |
| inilibing at bulag sa pamamagitan ng | ||
| Hybrid | Mataas na Materyal ng Frequency tulad ng RO4350B at FR4 Mix atbp. | |
| Mataas na Bilis na Materyal tulad ng M7NE at FR4 Mix atbp. | ||
| Materyal | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.bp |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G atbp. | |
| high Speed | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 atbp. | |
| high Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 atbp. | |
| Ang iba pa | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, ceramic-based atbp. | |
| Kapal | 0.3mm-8mm | |
| Max.copper Kapal | 10OZ | |
| Minimum na linya ng Lapad at Puwang | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0.35mm | |
| Min na Laki ng mekanikal na Drilled | 0.15mm (6mil) | |
| Aspect Ratio para sa pamamagitan ng butas | 16 ： 1 | |
| Tapos na sa Labas | HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc. | |
| Sa pamamagitan ng Pagpipilian ng Punan | Ang via ay pinahiran at pinunan ng alinman sa conductive o non-conductive epoxy pagkatapos ay naka-cap at na-plated over (VIPPO) | |
| Puno ng tanso, puno ng pilak | ||
| Pagpaparehistro | ± 4mil | |
| Panghinang Mask | Green, Pula, Dilaw, Asul, Puti, Itim, Lila, Matte Itim, Matte berde. Atbp. | |
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