HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Maikling Paglalarawan:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

Ang isang Ang HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Detalye ng Produkto

Mga Madalas Itanong

produkto Mga Tag

Mga parameter

Layer: 12

Base Material:FR4 High Tg EM827

Kapal ： 1.2 ± 0.1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Minimum na Pag-clear sa pagitan ng Inner Layer PTH at Line ： 0.2mm

Size：101mm×55mm

Aspect Ratio: 8: 1

Ibabaw ng paggamot: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Mga Application: Telecommunication

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the Ang HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI nagbibigay-daan sa ang koneksyon sa pagitan ng anumang mga layer;

2.Cross-layer laser processing ay maaaring mapahusay ang antas ng kalidad ng multi-hakbang na HDI;

3.The kumbinasyon ng HDI at mataas na dalas ng mga materyales, metal-based laminates, FPC at iba pang mga espesyal na laminates at mga proseso paganahin ang mga pangangailangan ng mataas na density at mataas na frequency, mataas na init pagsasagawa, o 3D assembly.

YMS HDI PCB manufacturing capa bilities:

Pangkalahatang-ideya ng mga kakayahan sa pagmamanupaktura ng YMS HDI PCB
Tampok	mga kakayahan
Bilang ng Layer	4-60L
Magagamit na Teknolohiya ng HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Anumang layer
Kapal	0.3mm-6mm
Minimum na linya ng Lapad at Puwang	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min Laki ng Drilling na Sukat	0.075mm (3nil)
Min na Laki ng mekanikal na Drilled	0.15mm (6mil)
Aspect Ratio para sa butas ng laser	0.9: 1
Aspect Ratio para sa pamamagitan ng butas	16: 1
Tapos na sa Labas	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Sa pamamagitan ng Pagpipilian ng Punan	Ang via ay pinahiran at pinuno ng alinman sa kondaktibo o di-kondaktibong epoxy pagkatapos ay naka-cap at naipahiran
	Puno ng tanso, puno ng pilak
	Laser sa pamamagitan ng tanso na tubog sarado
Pagpaparehistro	± 4mil
Panghinang Mask	Green, Pula, Dilaw, Asul, Puti, Itim, Lila, Matte Itim, Matte berde. Atbp.