Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in истеҳсолии .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Муқаддима Шӯрои ноҳиявии чопшуда
Шӯрои ноҳиявии чопии муқаррарӣ: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS қобилияти истеҳсолии PCB муқаррарӣ:
| Шарҳи умумии имкониятҳои истеҳсолии YMS | ||
| Хусусият | имкониятҳо | |
| Ҳисоби қабати | 1-60л | |
| Технологияи оддии PCB мавҷуд аст | Тавассути сӯрохи бо таносуби ҷанбаи 16: 1 | |
| дафн ва нобино тавассути | ||
| Гибрид | Маводи басомади баланд, ба монанди RO4350B ва FR4 Mix ва ғ. | |
| Маводи баландсуръат, ба монанди M7NE ва FR4 Mix ва ғ. | ||
| Мавод | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5. ва ғ |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G ва ғайра. | |
| Суръати баланд | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 ва ғайра. | |
| Фосила баланд | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 ва ғ. | |
| Дигарон | Полимид, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, дар асоси сафолb ва ғ. | |
| Ғафсӣ | 0.3мм-8мм | |
| Ғафсӣ мис | 10OZ | |
| Хати минималӣ Васеъ ва Фазо | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0.35мм | |
| Андозаи ҳадди аққали механикӣ | 0,15 мм (6 мил) | |
| Таносуби ҷанба тавассути сӯрохи | 16: 1 | |
| Марра рeизаминb | HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Ангушти тиллоӣ, Electroplating Gold Gold Hard, Selective OSP ， ENEPIG.etc. | |
| Тавассути опсияи пуркунӣ | Тавассути пӯшонида мешавад ва бо эпокси ё ноқилӣ ё ноқилнок пур карда мешавад ва сипас болои он пӯшонида мешавад (VIPPO) | |
| Мис пур, нуқра пур | ||
| Бақайдгирӣ | ± 4 мил | |
| Маски Solder | Сабз, сурх, зард, кабуд, сафед, сиёҳ, арғувон, матои сиёҳ, сабз сабз. Ва ғайра. | |
Мумкин аст, шумо мехостед:
1, мухтасар оид ба масъалаҳои ниёз ба таваҷҷӯҳ кафшери Шӯрои ноҳиявӣ
3, чӣ PCB аст
Дар бораи маҳсулоти YMS бештар омӯзед
