HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Maelezo Mafupi:

HDI iliyochapishwa bodi za mzunguko offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

vigezo

Tabaka: 8

Base Material:FR4 High Tg EM827

Unene: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Kiwango cha chini upana wa mistari / Nafasi: 0.10mm / 0.10mm

Usafi wa chini kati ya Tabaka la Ndani PTH na Line: 0.2mm

Ukubwa: 222mm x 120mm

Aspect Ratio：10.6 : 1

Matibabu ya uso: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Maombi: Kompyuta

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Bidhaa Detail

Maswali

Tags bidhaa

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Bodi Uzalishaji:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Kwa ujumla, mchakato wa uzalishaji wa HDI sahani ni tata, ambayo mahitaji ya kukamilika baada ya mara nyingi ya uzalishaji kwa muda mrefu. Siyo tu mahitaji ya juu kwa usahihi na shrinkage udhibiti wa kila safu, lakini pia viwango vya juu katika nyenzo, vifaa, mazingira na wafanyakazi wa kiufundi.

YMS HDI PCB manufacturing capabilities:

Maelezo ya jumla ya uwezo wa utengenezaji wa YMS HDI
Makala	uwezo
Hesabu ya Tabaka	4-60L
Inapatikana HDI PCB Teknolojia	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Safu yoyote
Unene	0.3mm-6mm
Kima cha chini cha upana na nafasi	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35 mm
Ukubwa mdogo wa laser	0.075mm (3nil)
Ukubwa mdogo wa mitambo	0.15mm (6mil)
Uwiano wa kipengele cha shimo la laser	0.9: 1
Uwiano wa vipengele kwa kupitia shimo	16: 1
Kumaliza uso	HASL, Kiongozi wa bure HASL, ENIG, Bati ya kuzamisha, OSP, Fedha ya Kuzamisha, Kidole cha Dhahabu, Electrlating Hard Hard, OSP Selective, ENEPIG.etc.
Kupitia Chaguo la Kujaza	Njia hiyo imefunikwa na kujazwa na epoxy inayoweza kusonga au isiyo ya kushughulikia kisha imefungwa na kufunikwa juu
	Shaba imejazwa, fedha imejazwa
	Laser kupitia shaba iliyofungwa imefungwa
Usajili	± 4mil
Mask ya Solder	Kijani, Nyekundu, Njano, Bluu, Nyeupe, Nyeusi, Zambarau, Matte Nyeusi, Matte kijani n.k.