Any layer hdi pcb 12Layer Staggered Vias Immersion Gold| YMS PCB

Maelezo Mafupi:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

vigezo

Tabaka: 12L HDI safu yoyote ya pcb

Mawazo ya Bodi: 1.6mm

Base Material:FR4 High Tg S1170

Mashimo Madogo: 0.2mm

Kiwango cha chini cha Upana wa Mstari / Usafi: 0.075mm / 0.075mm

Usafi wa chini kati ya Tabaka la Ndani PTH na Line: 0.2mm

Size：981mm×65mm

Uwiano wa Vipengele: 10: 1

Matibabu ya uso: ENIG

Speciality: Any layer hdi pcb, Laser via copper plated shut

Impedance tofauti 100 + 7 / -8Ω

Maombi: Mawasiliano

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What is HDI PCB?

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Faida za HDI PCB

Sababu ya kawaida ya kutumia teknolojia ya HDI ni ongezeko kubwa la wiani wa ufungaji. Nafasi iliyopatikana na miundo bora ya wimbo inapatikana kwa vifaa. Kwa kuongezea, mahitaji ya jumla ya nafasi yamepunguzwa itasababisha saizi ndogo za bodi na tabaka chache.

Kawaida FPGA au BGA zinapatikana kwa nafasi ya 1mm au chini. Teknolojia ya HDI inafanya uelekezaji na unganisho kuwa rahisi, haswa wakati wa kusafirisha kati ya pini.

YMS HDI PCB utengenezaji wa huduma za capa :

Maelezo ya jumla ya uwezo wa utengenezaji wa YMS HDI
Makala	uwezo
Hesabu ya Tabaka	4-60L
Inapatikana HDI PCB Teknolojia	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Safu yoyote
Unene	0.3mm-6mm
Kima cha chini cha upana na nafasi	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35 mm
Ukubwa mdogo wa laser	0.075mm (3nil)
Ukubwa mdogo wa mitambo	0.15mm (6mil)
Uwiano wa kipengele cha shimo la laser	0.9: 1
Uwiano wa vipengele kwa kupitia shimo	16: 1
Kumaliza uso	HASL, Kiongozi wa bure HASL, ENIG, Bati ya kuzamisha, OSP, Fedha ya Kuzamisha, Kidole cha Dhahabu, Electrlating Hard Hard, OSP Selective, ENEPIG.etc.
Kupitia Chaguo la Kujaza	Njia hiyo imefunikwa na kujazwa na epoxy inayoweza kusonga au isiyo ya kushughulikia kisha imefungwa na kufunikwa juu
	Shaba imejazwa, fedha imejazwa
	Laser kupitia shaba iliyofungwa imefungwa
Usajili	± 4mil
Mask ya Solder	Kijani, Nyekundu, Njano, Bluu, Nyeupe, Nyeusi, Zambarau, Matte Nyeusi, Matte kijani n.k.