China SMD LED display screen pcb Micro led pcb mini led BT| YMSPCB factory and manufacturers | Yongmingsheng
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SMD LED display screen pcb Micro led pcb mini led BT| YMSPCB

Pondok Description:

SMD LED BT Substrate  display screen pcb Characteristics: high density interconnect PCB, via in PAD design, no through hole, HDI design, laser via copper plated shut. Fine Pitch,is manufactured with BT Materials.

parameter

Layers: 4L SMD LED Substrate PCB any layer HDI

Board Thinkness:0.3mm

Base Material:Mistubishi BT

Min mechanical buried Holes:0.15mm

Min mechanical through Holes:0.15mm

Mnt laser vias: 0,075mm

Light Emitting Diode Pitch:0.77mm

Lebar Gariswanci minimum / Izin : 0.05mm / 0.05mm

Izin minimum antara Lapisan Batin PTH sareng Garis : 0.18mm

Size:120mm×38mm

Aspect Ratio for laser via:0.85: 1

perlakuan beungeut: ENIG

Speciality: 4L any layer HDI pcb, Mistubishi BT Material

Applications:LED display


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Waht is SMD LED BT Substrate:

SMD LED BT Substrate refers to THE PCB that is manufactured with BT Materials and applied to SMD LED products.Different from PCB normal, BT Materials is applied in MD LED BT Substrate, which is mainly product by Mistubishi Gas Chemical Co., Inc.The BT Materials made of B (Bismaleimide) and T (Triazine)  resin has the advantages of high TG (255~330°C), heat resistance (160~230°C), moisture resistance, low dielectric constant (DK) and low dissipation factor (Df). SMD LED is a new surface mount semiconductor light-emitting device , with a small scattering angle is large , light uniformity, high reliability , light colors including white colors , it is widely used in a variety of electronic products . PCB board is one of the major manufacturing SMD LED material .

P0.58 SMD LED tampilan dicitak circuit board jero ruangan mini dipimpin layar tampilan pcb Micro led display board 4L lapisan naon HDI SMD LED BT

 Difference between SMD and COB LED

SMD refers to the term “Surface Mounted Device” LEDs, which are the utmost shared LEDs in the market. The LED chip is eternally fused to a printed circuit board (PCB), and it is especially popular because of its versatility. he PCB is built on a rectangular-shaped, flat object, which is what we usually see as SMD. If you look into SMD LED closely, you can see a small black point right in the center of the SMD; that is the LED chip. You can find it in light bulbs and filament lights and even in the notification light on your mobile phone.

One of the latest developments in LED industry is COB or “Chip on Board” technology which is a step forward for more efficient energy use. Similar to SMD, COB chips too have multiple diodes on the same surface. But the difference among LED light COB and SMD is that COB LEDs have more diodes.

Advantages of SMD LED

1)    The SMD is more flexible, and the display of its chips is decided according to the printed circuit board layout, and it can be altered to meet different engineering solutions.

2)    SMD light source has a bigger illumination angle of up to 120 & Phi; 160 degrees, small size and light weight of electronic products, high assembly density and the size and weight of the cover components are only about 1/10 of that of conventional plug-in components.

3)    It has high reliability and strong anti-vibration capability.

4)    Low solder joint defect rate and improve production efficiency.

Schematic diagrams of wire bonding and flip chip 

wire bonding and Flip chip

YMS SMD LED display screen pcb manufacturing capabilities:

YMS SMD LED display screen pcb manufacturing capabilities overview
Fitur kamampuan
Lapisan Count 1-60L
Available SMD LED display screen pcb Technology 1 + N + 1
2 + N + 2
3 + N + 3
4 + N + 4
5 + N + 5
Lapisan naon waé
Kandel 0.3mm-6mm
Lebar minimum sareng Spasi 0.05mm / 0.05mm (2mil / 2mil)
Lampu Emitting Diode PITCH P0.47mm; P0.58mm; P0.70mm; P0.77mm; P0.925mm; P1.0mm; jsb.
Mnt laser dibor Ukuran 0.075mm (3nil)
Ukuran mékanis dibor mékanis 0.15mm (6mil)
Aspék Rasio pikeun liang laser 0.9: 1
Aspék Rasio pikeun liwat liang 16: 1
Permukaan Rengse HASL, Lead gratis HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP , ENEPIG.etc.
Ngalangkungan Pilihan Eusian Via dilapis sareng dieusi ku epoxy konduktif atanapi non-conductive teras dicabok sareng dilapis langkung
Tambaga dieusian, pérak dieusian
Laser liwat tambaga dilapis Cicing
Pendaptaran ± 4mil
Masker Solder Héjo, Beureum, Konéng, Biru, Bodas, Hideung, Ungu, Matte Hideung, Matte héjo. Sareng sajabana.

 

 

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