HDI pcb lapisan naon wae hdi pcb uji coba leungitna sisipan gancang enepig | YMSPCB
Naon HDI PCB
HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.
Kaunggulan tina HDI PCB
Alesan anu paling umum pikeun ngagunakeun téknologi HDI nyaéta kanaékan kapadetan bungkus anu signifikan. Rohangan anu diala ku struktur lagu anu langkung saé sayogi pikeun komponén. Di sagigireun éta, sarat rohangan sacara umum dikirangan bakal ngahasilkeun ukuran dewan anu langkung alit sareng lapisan anu kirang.
Biasana FPGA atanapi BGA sayogi sareng jarak 1mm atanapi kirang. Téknologi HDI ngajantenkeun pangarahan sareng sambungan gampang, utamina nalika ngalirkeun antara pin.
YMS HDI PCB manufaktur capa pangabisa:
Pangabisa kamampuan pembuatan YMS HDI PCB | |
Fitur | kamampuan |
Lapisan Count | 4-60L |
Sadia Téknologi HDI PCB | 1 + N + 1 |
2 + N + 2 | |
3 + N + 3 | |
4 + N + 4 | |
5 + N + 5 | |
Lapisan naon waé | |
Kandel | 0.3mm-6mm |
Lebar minimum sareng Spasi | 0.05mm / 0.05mm (2mil / 2mil) |
BGA PITCH | 0,35 mm |
Mnt laser dibor Ukuran | 0.075mm (3nil) |
Ukuran mékanis dibor mékanis | 0.15mm (6mil) |
Aspék Rasio pikeun liang laser | 0.9: 1 |
Aspék Rasio pikeun liwat liang | 16: 1 |
Permukaan Rengse | HASL, Lead gratis HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP , ENEPIG.etc. |
Ngalangkungan Pilihan Eusian | Via dilapis sareng dieusi ku epoxy konduktif atanapi non-conductive teras dicabok sareng dilapis langkung |
Tambaga dieusian, pérak dieusian | |
Laser liwat tambaga dilapis Cicing | |
Pendaptaran | ± 4mil |
Masker Solder | Héjo, Beureum, Konéng, Biru, Bodas, Hideung, Ungu, Matte Hideung, Matte héjo. Sareng sajabana. |