HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Pondok Description:

papan sirkuit dicitak HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parameter

Lapisan: 8

Base Material:FR4 High Tg EM827

Ketebalan: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimum Line Width / Spasi: 0.10mm / 0.10mm

Izin minimum antara Lapisan Batin PTH sareng Garis ： 0.2mm

Ukuran: 222mm × 120mm

Aspect Ratio：10.6 : 1

perlakuan beungeut: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasi: Komputer

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FAQ

Tags produk

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

proses produksi IPM Board:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Dina sakabéhna, proses produksi plat IPM téh kompléks, anu perlu réngsé sanggeus sababaraha kali produksi pikeun lila. Ieu mah ngan saukur syarat tinggi keur akurasi sarta shrinkage kontrol unggal lapisan, tapi ogé standar tinggi di bahan, alat-alat, lingkungan jeung tanaga téknis.

YMS HDI PCB manufacturing capabilities:

Pangabisa kamampuan pembuatan YMS HDI PCB
Fitur	kamampuan
Lapisan Count	4-60L
Sadia Téknologi HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lapisan naon waé
Kandel	0.3mm-6mm
Lebar minimum sareng Spasi	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Mnt laser dibor Ukuran	0.075mm (3nil)
Ukuran mékanis dibor mékanis	0.15mm (6mil)
Aspék Rasio pikeun liang laser	0.9: 1
Aspék Rasio pikeun liwat liang	16: 1
Permukaan Rengse	HASL, Lead gratis HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Ngalangkungan Pilihan Eusian	Via dilapis sareng dieusi ku epoxy konduktif atanapi non-conductive teras dicabok sareng dilapis langkung
	Tambaga dieusian, pérak dieusian
	Laser liwat tambaga dilapis Cicing
Pendaptaran	± 4mil
Masker Solder	Héjo, Beureum, Konéng, Biru, Bodas, Hideung, Ungu, Matte Hideung, Matte héjo. Sareng sajabana.