High Tg PCB Advanced PCB Manufacturing| YMS PCB

Pondok Description:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

parameter

Layers: 4L High Tg FR4 Material

Pikiran Papan: 1.6mm

Base Material:EM827 High tg

Liang Liang: 0.2mm

Lebar Gariswanci minimum / Izin ： 0.075mm / 0.075mm

Izin minimum antara Lapisan Batin PTH ka Garis ： 0.2mm

Size：208mm×148mm

Aspék Rasio: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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How do I classify high-TG materials?

Bahan	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Fitur	kamampuan
Lapisan Count	3-60L
Sadia Téhnologi PCB Multilayer	Ngalangkungan liang sareng Aspék Rasio 16: 1
	dikubur sareng buta via
	Hibrida	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Kandel	0.3mm-8mm
Lebar minimum sareng Spasi	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Ukuran mékanis dibor mékanis	0.15mm (6mil)
Aspék Rasio pikeun liwat liang	16: 1
Permukaan Rengse	HASL, Lead gratis HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Ngalangkungan Pilihan Eusian	Via dilapis sareng dieusi epoxy konduktif atanapi non-konduktif teras dicabok sareng dilapis (VIPPO)
	Tambaga dieusian, pérak dieusian
Pendaptaran	± 4mil
Masker Solder	Héjo, Beureum, Konéng, Biru, Bodas, Hideung, Ungu, Matte Hideung, Matte héjo. Sareng sajabana.