Any layer hdi pcb 12Layer Staggered Vias Immersion Gold| YMS PCB

Pondok Description:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

parameter

Lapisan: 12L HDI sagala-lapisan pcb

Pikiran Papan: 1.6mm

Base Material:FR4 High Tg S1170

Liang Liang: 0.2mm

Lebar Gariswanci minimum / Izin ： 0.075mm / 0.075mm

Izin minimum antara Lapisan Batin PTH sareng Garis ： 0.2mm

Size：981mm×65mm

Aspék Rasio ： 10: 1

perlakuan beungeut: ENIG

Speciality: Any layer hdi pcb, Laser via copper plated shut

Imédansi bédana 100 + 7 / -8Ω

Aplikasi: Komunikasi

Kirim surélék ka kami Ngundeur sakumaha PDF

jéntré produk

Tags produk

What is HDI PCB?

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Kaunggulan tina HDI PCB

Alesan anu paling umum pikeun ngagunakeun téknologi HDI nyaéta kanaékan kapadetan bungkus anu signifikan. Rohangan anu diala ku struktur lagu anu langkung saé sayogi pikeun komponén. Di sagigireun éta, sarat rohangan sacara umum dikirangan bakal ngahasilkeun ukuran dewan anu langkung alit sareng lapisan anu kirang.

Biasana FPGA atanapi BGA sayogi sareng jarak 1mm atanapi kirang. Téknologi HDI ngajantenkeun pangarahan sareng sambungan gampang, utamina nalika ngalirkeun antara pin.

YMS HDI PCB manufaktur capa pangabisa:

Pangabisa kamampuan pembuatan YMS HDI PCB
Fitur	kamampuan
Lapisan Count	4-60L
Sadia Téknologi HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lapisan naon waé
Kandel	0.3mm-6mm
Lebar minimum sareng Spasi	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Mnt laser dibor Ukuran	0.075mm (3nil)
Ukuran mékanis dibor mékanis	0.15mm (6mil)
Aspék Rasio pikeun liang laser	0.9: 1
Aspék Rasio pikeun liwat liang	16: 1
Permukaan Rengse	HASL, Lead gratis HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Ngalangkungan Pilihan Eusian	Via dilapis sareng dieusi ku epoxy konduktif atanapi non-conductive teras dicabok sareng dilapis langkung
	Tambaga dieusian, pérak dieusian
	Laser liwat tambaga dilapis Cicing
Pendaptaran	± 4mil
Masker Solder	Héjo, Beureum, Konéng, Biru, Bodas, Hideung, Ungu, Matte Hideung, Matte héjo. Sareng sajabana.