HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Pondok Description:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

Hiji HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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parameter

Lapisan: 12

Base Material:FR4 High Tg EM827

Kandel ： 1,2 ± 0,1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Izin minimum antara Lapisan Batin PTH sareng Garis ： 0.2mm

Size：101mm×55mm

Aspék Rasio: 8: 1

perlakuan beungeut: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasi: Telekomunikasi

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-hambalan IPM nyandak éta sambungan antara sagala lapisan;

2.Cross-lapisan processing laser bisa ningkatkeun tingkat kualitas multi-hambalan IPM;

Kombinasi 3.The tina IPM sarta bahan frékuénsi luhur, laminates dumasar-logam, Urang Sunda na laminates husus sejenna jeung prosés ngaktipkeun kaperluan dénsitas luhur jeung frékuénsi luhur, ngalakonan panas tinggi, atanapi assembly 3D.

YMS HDI PCB manufaktur capa pangabisa:

Pangabisa kamampuan pembuatan YMS HDI PCB
Fitur	kamampuan
Lapisan Count	4-60L
Sadia Téknologi HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lapisan naon waé
Kandel	0.3mm-6mm
Lebar minimum sareng Spasi	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Mnt laser dibor Ukuran	0.075mm (3nil)
Ukuran mékanis dibor mékanis	0.15mm (6mil)
Aspék Rasio pikeun liang laser	0.9: 1
Aspék Rasio pikeun liwat liang	16: 1
Permukaan Rengse	HASL, Lead gratis HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Ngalangkungan Pilihan Eusian	Via dilapis sareng dieusi ku epoxy konduktif atanapi non-conductive teras dicabok sareng dilapis langkung
	Tambaga dieusian, pérak dieusian
	Laser liwat tambaga dilapis Cicing
Pendaptaran	± 4mil
Masker Solder	Héjo, Beureum, Konéng, Biru, Bodas, Hideung, Ungu, Matte Hideung, Matte héjo. Sareng sajabana.