U batla ho tseba kakaretso ea kakaretso ea lihlahisoa ?

Aluminium botlaaseng poleiti ke mofuta oa tšepe botlaaseng poleiti clad le mosebetsi o motle mocheso dissipation. Ha re utloisise tlhophiso ea poleiti ea aluminium ea PCB.

1.flexible aluminium substrate

E 'ngoe ea lintlafatso tsa morao-rao tsa thepa ea IMS ke dielectric e feto-fetohang. Lisebelisoa tsena li fana ka ts'ireletso e ntle ea motlakase, ho tenyetseha le ho futhumatsa ha motlakase Ha e sebelisoa ho lisebelisoa tsa aluminium tse tenyetsehang, lihlahisoa li ka theoa ho fihlela libopeho le li-angles tse fapaneng, tse ka felisang lisebelisoa tse turang, likhoele le likhokelo.

2.mixed aluminium substrate

Tse tloaelehileng ka ho fetesisa ke li-subassemblies tse 2-layer kapa 4-layer tse entsoeng ka FR-4 e tloaelehileng, e hokahantsoeng le substrate ea aluminium e nang le dielectric ea thermoelectric ho thusa mochesong oa mocheso, ho eketsa ho tenyetseha le ho sebetsa joalo ka tšireletso.

3.multi-layer aluminium substrate

Ts'ebetsong e phahameng ea phepelo ea motlakase e sebetsang, li-IMSPCB tse ngata li entsoe ka dielectric e tsamaisang mekhahlelo e mengata. Meaho ena e na le mekhahlelo e le 'ngoe kapa ho feta ea lipotoloho tse kentsoeng ka hara dielectric, e nang le masoba a foufetseng a sebelisoang e le maqhubu a mocheso kapa litsela tsa ho supa.

4. ka mokoti oa aluminium sub hole

Mehahong e rarahaneng ka ho fetesisa, karolo e le 'ngoe ea aluminium e ka theha "konokono" ea likarolo tse ngata tsa sebopeho sa mocheso. Aluminium e entsoe esale pele mme e tlatsoa ka dielectric pele ho lamination. Sesebelisoa se chesang kapa subassembly e ka tšeloa ka lehlakoreng le leng la aluminium e sebelisa Hang ha e koahetsoe, karolo e feliloeng e ts'oana le mochini oa aluminium oa multilayer ka ho cheka masoba. Electroplating ka masoba a feta likheo tsa aluminium ho boloka motlakase oa motlakase.

Ka holimo ke tlhophiso le kakaretso ea PCB aluminium substrate, ke ts'epa ho u thusa, re moetsi oa PCB ea aluminium substrate ea tsoang China, re amohela ho botsa!