Habeli mahlakoreng tšepe konokono pcb Copper Base High Power Metal konokono Board| YMS PCB
Multi Layers MCPCB ke eng?
A Metal Core Printed Circuit Board (MCPCB) , e tsejoang hape e le PCB e futhumatsang kapa PCB e tšehelitsoeng ka tšepe, ke mofuta oa PCB o nang le thepa ea tšepe e le motheo oa eona bakeng sa karolo ea mocheso oa boto. Tšepe e teteaneng (hoo e batlang e le aluminium kapa koporo kamehla) e koahela lehlakore le le leng la PCB. Metal core e ka ba ho buuoa ka tšepe, ho ba bohareng ba kae-kae kapa ka morao ho boto. Morero oa mantlha oa MCPCB ke ho tsamaisa mocheso hole le likarolo tsa bohlokoa tsa boto le ho ea libakeng tseo e seng tsa bohlokoa haholo joalo ka tšepe ea heatsink kapa core ea tšepe. Litšepe tsa motheo ho MCPCB li sebelisoa e le mokhoa o mong oa liboto tsa FR4 kapa CEM3.
Boto ea potoloho ea tšepe ea mantlha e hatisitsoeng (MCPCB) eo hape e tsejoang e le PCB e futhumatsang, e kenyelletsa lisebelisoa tsa tšepe joalo ka motheo oa eona ho fapana le FR4 ea setso, bakeng sa sekhechana sa mocheso oa boto. Mocheso o eketseha ka lebaka la likarolo tse ling tsa elektronike nakong ea ts'ebetso ea boto. Morero oa tšepe ke ho khelosa mocheso ona hole le likarolo tsa bohlokoa tsa boto le ho ea libakeng tseo e seng tsa bohlokoa haholo joalo ka tšepe ea heatsink kapa core ea tšepe. Kahoo, li-PCB tsena li loketse taolo ea mocheso.
Ka MCPCB ea multilayer, lihlopha li tla aroloa ka ho lekana lehlakoreng le leng le le leng la motheo oa tšepe. Mohlala, ka boto ea mekato e 12, mokokotlo oa tšepe o tla ba bohareng ka likarolo tse 6 ka holimo le tse 6 ka tlase.
Li-MCPCB li boetse li bitsoa insulated metallic substrate (IMS), insulated metal PCBs (IMPCB), thermal clad PCBs, le tšepe-clad PCBs. Sengoliloeng sena, re tla be re sebelisa khutsufatso ea MCPCB ho qoba ho hlaka.
Li-MCPCB li entsoe ka likarolo tse sireletsang mocheso, lipoleiti tsa tšepe le foil ea koporo ea tšepe. Litaelo tse ling tsa meralo / likhothaletso tsa Metal Core (Aluminium le Copper) Liboto tsa Potoloho tse Hatisitsoeng li fumaneha ha li kopa; ikopanye le YMSPCB ho kell@ymspcb.com.kapa Moemeli oa hau oa Thekiso ho botsa haholoanyane.
YMS Multi Layers Metal konokono PCB bokhoni ba ho etsa:
YMS Multi Layers Metal core PCB tlhahiso ea bokhoni ba tlhahiso | ||
Tšobotsi | bokhoni | |
Palo ea Lera | 1-8L | |
Boitsebiso ba Base | Aluminium/Copper/Iron Alloy | |
Botenya | 0.8 mm mets | |
Lintho tsa tšepe Botenya | 0.8-3.0mm | |
Bophara ba mola le Bonyane | 0.05mm / 0.05mm (2mil / 2mil) | |
BGA PITCH | 0.35 limilimithara | |
Tlhaloso ea chelete ea tšepe ea Min Copper | 1.0mm mets | |
Mets phethahetse Drilled Size | 0.15mm (6mil) | |
Boemo ba tšobotsi bakeng sa lesoba | 16: 1 | |
Holim qeta | HASL, E etella pele mahala HASL, ENIG, qoelisoa Tin, OSP, qoelisoa Silver, Gold monoana, Electroplating Hard Khauta, khetla OSP , ENEPIG.etc. | |
Ka Khetho ea ho Tlatsa | Tsela e koahetsoe ebe e tlatsoa ka epoxy e tsamaisang kapa e sa tsamaeeng ebe e koaheloa le ho koaheloa (VIPPO) | |
Koporo e tlatsitsoe, silevera e tletse | ||
Ngoliso | ± 4mil | |
Mask ea solder | Green, Red, Yellow, Blue, White, Black, Pherese, Matte Black, Matte tala.etc. |
Mabaka a ka sehloohong a ho sebelisa mapolanka a motheo a koporo
1. Phallo e ntle ea mocheso:
Hona joale, liboto tse ngata tsa 2 le li- multilayer li na le monyetla oa ho ba le matla a mangata le matla a phahameng, empa ho thata ho hlahisa mocheso. Lintho tse tloaelehileng tsa motheo tsa PCB tse kang FR4, CEM3 ke conductor e futsanehileng ea mocheso, ho kenya letsoho ho pakeng tsa lihlopha, 'me mocheso o ke ke oa tima. Ho futhumatsa sebakeng sa lisebelisoa tsa elektronike ho ke ke ha felisoa ho tla fella ka ho hlōleha ha mocheso o phahameng oa likarolo tsa elektronike. Empa ts'ebetso e ntle ea ho senya mocheso ea tšepe ea mantlha ea PCB e ka rarolla bothata bona ba ho senya mocheso.
2. Boemo bo tsitsitseng:
Metal core PCB ho hlakile hore e tsitsitse ka boholo ho feta liboto tse hatisitsoeng tsa thepa e sireletsang. Aluminium base board le aluminium sandwich board e futhumatsa ho tloha ho 30 ℃ ho isa ho 140 ~ 150 ℃, boholo ba eona bo fetoha 2.5 ~ 3.0%.
3. Lebaka le leng:
Boto ea motheo ea koporo e na le tšireletso 'me e nkela sebaka sa brittle ceramic substrate, kahoo e ka kholiseha hore e tla sebelisa theknoloji ea ho kenya holim'a metsi ho fokotsa sebaka sa sebele sa PCB. Boto ea koporo e nka sebaka sa radiator le likarolo tse ling, e ntlafatsa ho hanyetsa mocheso le ts'ebetso ea 'mele ea lihlahisoa mme e fokotsa litšenyehelo tsa tlhahiso le litšenyehelo tsa basebetsi.
U ka Thabela:
1. Litšobotsi tsa tšebeliso ea aluminium PCB
2. Ts'ebetso ea koporo ea koporo ea PCB e kantle (PTH)
3, poleiti ea koporo le aluminium substrate liphapang tse 'nè tse kholo