Any layer hdi pcb 12Layer Staggered Vias Immersion Gold| YMS PCB

Short Tlhaloso:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

entsprechen

Lera: 12L HDI leha e le efe-lera pcb

Monahano oa Boto: 1.6mm

Base Material:FR4 High Tg S1170

Mekoti e Monyane: 0.2mm

Bophara ba Line Line Bophara / Tlhakiso: 0.075mm / 0.075mm

Phokotso e nyane lipakeng tsa lera la kahare PTH le Line: 0.2mm

Size：981mm×65mm

Tekanyo ea likarolo: 10: 1

Holim kalafo: ENIG

Speciality: Any layer hdi pcb, Laser via copper plated shut

Phapang impedance 100 + 7 / -8Ω

Dikopo: Puisano

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Product Qaqileng

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What is HDI PCB?

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Melemo ea HDI PCB

Lebaka le tloaelehileng haholo la ho sebelisa theknoloji ea HDI ke keketseho e kholo ea bongata ba liphutheloana. Sebaka se fumanoeng ke meaho e metle haholo sea fumaneha bakeng sa likarolo. Ntle le moo, litlhoko tsa sebaka se felletseng li tla fella ka boholo ba boto e nyane le likarolo tse fokolang.

Hangata FPGA kapa BGA li fumaneha ka sekhahla sa 1mm kapa ka tlase. Theknoloji ea HDI e etsa hore ho tsamaisoa habonolo le khokahano ho be bonolo, haholo ha ho tsamaisoa lipakeng tsa lithakhisa.

YMS HDI PCB e etsa capa :

Kakaretso ea bokhoni ba tlhahiso ea YMS HDI PCB
Tšobotsi	bokhoni
Palo ea Lera	4-60L
Fumaneha HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lera lefe kapa lefe
Botenya	0.3mm-6mm
Bophara ba mola le Bonyane	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35 limilimithara
Mets tham mong bang laser e ile ea fata Size	0.075mm (3nil)
Mets phethahetse Drilled Size	0.15mm (6mil)
Tekanyo ea likarolo tsa lesoba la laser	0.9: 1
Boemo ba tšobotsi bakeng sa lesoba	16: 1
Holim qeta	HASL, E etella pele mahala HASL, ENIG, qoelisoa Tin, OSP, qoelisoa Silver, Gold monoana, Electroplating Hard Khauta, khetla OSP ， ENEPIG.etc.
Ka Khetho ea ho Tlatsa	Tsela e koahetsoe ebe e tlatsoa ka epoxy e tsamaisang kapa e sa tsamaeeng ebe e koaheloa ebe e koahetsoa
	Koporo e tlatsitsoe, silevera e tletse
	Laser ka koporo tlotsitsoe koaloa
Ngoliso	± 4mil
Mask ea solder	Green, Red, Yellow, Blue, White, Black, Pherese, Matte Black, Matte tala.etc.