HDI PCB 12 Layer 2 Step HDI Board | YMS PCB
entsprechen
Le dikarolo: 12
Base Material:FR4 High Tg EM827
Botenya: 1.2 ± 0.1mm
Min.Hole Size:0.15mm
Minimum Line Width/Space:0.075mm/0.075mm
Phokotso e nyane lipakeng tsa lera la kahare PTH le Line: 0.2mm
Size:101mm×55mm
Tšobotsi karo-karolelano: 8: 1
Holim kalafo: ENIG
Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole
Dikopo: tlhaeletsanong ya
What is HDI PCBs?
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
1.Multi-mohato HDI nolofalletsa amana le dikarolo efe kapa efe;
2.Cross-lera ka laser sebetsa ka khona ho ntlafatsa boemo le boleng ba-mohato selotlolo HDI;
3.The motsoako oa HDI le thepa phahameng maqhubu a, laminates tšepe tse thehiloeng Bibeleng, FPC le laminates tse ling e khethehileng le e hlophisitsweng, etsa hore litlhoko tsa segokanyipalo phahameng le maqhubu a phahameng, e phahameng mocheso tso'ara, kapa e nyenyane 3D.
YMS HDI PCB e etsa capa :
Kakaretso ea bokhoni ba tlhahiso ea YMS HDI PCB | |
Tšobotsi | bokhoni |
Palo ea Lera | 4-60L |
Fumaneha HDI PCB Technology | 1 + N + 1 |
2 + N + 2 | |
3 + N + 3 | |
4 + N + 4 | |
5 + N + 5 | |
Lera lefe kapa lefe | |
Botenya | 0.3mm-6mm |
Bophara ba mola le Bonyane | 0.05mm / 0.05mm (2mil / 2mil) |
BGA PITCH | 0.35 limilimithara |
Mets tham mong bang laser e ile ea fata Size | 0.075mm (3nil) |
Mets phethahetse Drilled Size | 0.15mm (6mil) |
Tekanyo ea likarolo tsa lesoba la laser | 0.9: 1 |
Boemo ba tšobotsi bakeng sa lesoba | 16: 1 |
Holim qeta | HASL, E etella pele mahala HASL, ENIG, qoelisoa Tin, OSP, qoelisoa Silver, Gold monoana, Electroplating Hard Khauta, khetla OSP , ENEPIG.etc. |
Ka Khetho ea ho Tlatsa | Tsela e koahetsoe ebe e tlatsoa ka epoxy e tsamaisang kapa e sa tsamaeeng ebe e koaheloa ebe e koahetsoa |
Koporo e tlatsitsoe, silevera e tletse | |
Laser ka koporo tlotsitsoe koaloa | |
Ngoliso | ± 4mil |
Mask ea solder | Green, Red, Yellow, Blue, White, Black, Pherese, Matte Black, Matte tala.etc. |
U ka Thabela:
1, The application range and circuit advantage of HDI board are introduced
2, PCB production skills: HDI board CAM production method
3, PCB design of 1 step, 2 step and 3step HDI
4. HDI PCB Manufacturing process
5、Li-PCB tsa HDI li sebelisoa hokae
Ithute haholoanyane ka lihlahisoa tsa YMS
What is HDI in PCB?
HDI Boards – High Density Interconnect
What are the layers of a PCB?
Substrate Layer.
Copper Layer.
Soldermask layer.
Silkscreen layer.
What is HDI stackup?
HDI is short for high density interconnect, and refers to the use of buried, blind and micro vias as well as any layer HDIs to create compact boards.