Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in prodhimit të PCB -ve .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Hyrje në bordin e qarkut të shtypur
Tabela e qarkut të shtypur normal: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Aftësitë normale të prodhimit të PCB të YMS:
Pasqyrë e aftësive normale të prodhimit të PCB-së YMS | ||
Karakteristikë | aftësive | |
Numërimi i shtresave | 1-60L | |
Teknologjia e disponueshme normale e PCB | Përmes vrimës me Aspect Ratio 16: 1 | |
varrosur dhe verbër përmes | ||
Hibride | Material me frekuencë të lartë si RO4350B dhe FR4 Mix etj. | |
Material me Shpejtësi të Lartë si M7NE dhe FR4 Mix etj. | ||
Materiali | CEM- | CEM-1; CEM-2 ; CEM-4 ; CEM-5.etj |
FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G etj. | |
Shpejtësi e lartë | Seritë Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13, MW4000, MW2000, TU933 etj. | |
Frekuencë e lartë | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 etj. | |
Të tjerët | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, me bazë qeramike etj. | |
Trashësia | 0,3 mm-8 mm | |
Maks. Trashësia e bakrit | 10 OZ | |
Gjerësia dhe Hapësira minimale e linjës | 0,05 mm / 0,05 mm (2 milje / 2 milje) | |
NGROHJE BGA | 0.35 mm | |
Madhësia minimale e shpuar mekanike | 0.15 mm (6 milje) | |
Raporti i aspektit për përmes vrimës | 16 : 1 | |
Përfundojë sipërfaqe | HASL, HASL pa plumb, ENIG, Kallaj zhytjeje, OSP, Argjend i zhytjes, Gisht i artë, Plastifikim i arit të fortë, OSP le ENEPIG.lektive, etj. | |
Përmes opsionit të mbushjes | Vija kromohet dhe mbushet me epoksi përçuese ose jopërçuese, më pas mbyllet dhe mbyllet (VIPPO) | |
Mbushur bakri, mbushur argjendi | ||
Regjistrimi | 4 milje ± | |
Maskë ngjitëse | Jeshile, e kuqe, e verdhë, blu, e bardhë, e zezë, vjollcë, e zezë mat, jeshile e mat. Etj. |
Ju mund të pëlqeni:
1, Summary of matters needing attention in circuit board welding
3, What is PCB
4、Çfarë është testimi i bordit të zhveshur?
5. Çfarë është dizajni i PCB-ve me frekuencë të lartë