HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Description Gaaban:

looxyada wareegyada daabacan HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

xuduudaheedu

Lakab: 8

Base Material:FR4 High Tg EM827

Dhumucdiisuna: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Ugu Yar Line Width / Space: 0.10mm / 0.10mm

Nadiifinta Ugu Yar ee udhaxeysa Lakabka Gudaha PTH iyo Line ： 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

daaweynta dusha: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Codsiyada: Computer

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HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

habka wax soo saarka Board HDI:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

On oo dhan, habka wax soo saarka ee ahaa wasladdii khafiifka HDI ku adag yahay, taas oo loo baahan yahay in la dhameystiro ka dib markii marar badan ee wax soo saarka ah muddo dheer. Waa shuruudaha sare ee gacanta ku saxnaanta iyo yaraanshaha of lakabka kasta, laakiin sidoo kale heerka sare ee qalabka, qalabka, deegaanka iyo shaqaalaha farsamada ma aha oo kaliya.

YMS HDI PCB manufacturing capabilities:

Guudmarka waxsoosaarka waxsoosaarka YMS HDI PCB
Muuqaalka	awoodaha
Tirinta Lakabka	4-60L
Farsamada HDI PCB ee la heli karo	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lakab kasta
Dhumucdiisuna	0.3mm-6mm
Ballaaran khadka ugu yar iyo Booska	0.05mm / 0.05mm (2mil / 2mil)
GAROONKA BGA	0.35mm
Min laser Qodmay Size	0.075mm (3nil)
Min Qiyaas ahaan qodan Farsamo	0.15mm (6mil)
Saamiga saamiga ee daloolka laser	0.9: 1
Saamiga saamiga illaa daloolka	16: 1
Dhammeystirka dusha sare	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Finger Gold, Electroplating Gold Gold, Selective OSP ， ENEPIG.etc.
Via Buuxi Xulashada	Marinka ayaa la mariyaa oo lagu buuxiyaa epoxy tabinta ama aan-tabinta lahayn ka dibna la daboolaa oo la dul mariyaa
	Naxaas la buuxiyey, lacagna la buuxiyey
	Laser iyadoo la adeegsanayo naxaas dahaadhay
Diiwaangelinta	M 4milyan
Maaskaro Alxan	Cagaar, Casaan, Jaale, Buluug, Caddaan, Madoow, Midabbo, Matte Madow, Matte green. Iwm.