Akabatanidzwa edunhu substrates akapfura mukurumbira munguva pfupi yapfuura. Izvo zvakakonzerwa nekubuda kweakasanganiswa edunhu mhando senge chip-scale package (CSP) uye bhora grid package (BGP). Mapakeji eIC akadai anodaidzira vatakuri vepakeji, chimwe chinhu chinoverengerwa neIC substrate. Semugadziri wemagetsi kana mainjiniya, hazvicharatidzi zvakakwana kuti unzwisise kukosha kweIC package substrate. Iwe unofanirwa kunzwisisa iyo IC substrate yekugadzira maitiro, basa re substrate ICs mukushanda kwakanaka kwemagetsi, nenzvimbo dzayo dzekushandisa. IC substrate imhando yebhesi bhodhi rinoshandiswa kurongedza isina IC (integrate circuit) chip. Kubatanidza chip uye redunhu bhodhi, IC ndeyechigadzirwa chepakati chine mabasa anotevera:

• inotora semiconductor IC chip;

• pane nzira mukati kubatanidza chip uye PCB;

• inogona kudzivirira, kusimbisa uye kutsigira IC chip, ichipa mugero wekupisa wekupisa.

Zvimiro zveIC Substrate

Maseketi akabatanidzwa ane akawanda uye akasiyana maficha. Inosanganisira zvinotevera.

Chiedza kana zvasvika pakurema

Waya dze lead shoma nemajoini akatengeswa

Yakavimbika zvikuru

Kukwidziridzwa kwekuita kana humwe hunhu hwakadai sekuvimbika, kusimba, uye huremu hunoiswa mukati

Saizi diki Chii chinonzi kushopera kweIC substrate yePCB?

IC substrate imhando yebhodhi bhodhi rinoshandiswa kurongedza isina IC (kubatanidza wedunhu) chip. Kubatanidza chip uye redunhu bhodhi, IC ndeyechigadzirwa chepakati chine mabasa anotevera:

• inotora semiconductor IC chip;

• pane nzira mukati kubatanidza chip uye PCB;

• inogona kudzivirira, kusimbisa uye kutsigira IC chip, ichipa mugero wekupisa wekupisa. 

Zvishandiso zveIC Substrate PCB

IC substrate PCBs inonyanya kuiswa pane zvigadzirwa zvemagetsi zvine huremu huremu, hutete uye mabasa ari kufambira mberi, senge mafoni akangwara, laptop, piritsi PC uye network mundima dzenhare, kurapwa, kudzora maindasitiri, aerospace nemauto.

MaPCB akaomarara akatevera kuburikidza nenhevedzano yehunyanzvi kubva kumultilayer PCB, yechinyakare HDI PCBs, SLP (substrate-sePCB) kuenda kuIC substrate PCBs. SLP ingori rudzi rweakaomesesa maPCB ane akafanana ekugadzira maitiro anenge semiconductor chiyero.

Kuongorora Kugona uye Chigadzirwa Kuvimbika Test Technology

IC substrate PCB inodaidzira michina yekuongorora iyo yakasiyana neiyo inoshandiswa kune yechinyakare PCB. Pamusoro pezvo, mainjiniya anofanirwa kunge aripo ayo anokwanisa kugona hunyanzvi hwekuongorora pamidziyo yakakosha.

Zvese mune zvese, IC substrate PCB inodaidzira zvimwe zvinodiwa kupfuura yakajairwa PCB uye PCB vagadziri vanofanirwa kuve vakashongedzerwa nehunyanzvi hwekugadzira uye kuve nehunyanzvi mukuzvigona. Semugadziri ane makore mazhinji ePCB prototype ruzivo uye epamberi zvigadzirwa zvekugadzira, YMS inogona kuve mudiwa akakodzera kana iwe uchimhanyisa PCB chirongwa. Mushure mekupa mafaera ese ayo ekugadzira anodiwa, unogona kuwana yako prototype mabhodhi muvhiki kana zvishoma. Ndapota taura nesu kuti tiwane mutengo wakanakisisa uye nguva yekugadzira.