Ceramic PCBs inoumbwa neceramic substrate, yekubatanidza layer, uye dunhu redunhu. Kusiyana neMCPCB, maPCB e ceramic haana chigadziko chekudzivirira, uye kugadzira dhizaini yedunhu pane iyo ceramic substrate kwakaoma. Ko ceramic PCBs inogadzirwa sei? Sezvo zvinhu zveceramic zvaishandiswa sePCB substrates, akati wandei nzira dzakagadzirwa kugadzira dunhu redunhu pane ceramic substrate. Nzira idzi ndedzeHTCC, DBC, gobvu firimu, LTCC, nhete-firimu, uye DPC.

HTCC

Pros: simba repamusoro rekugadzirisa; high thermal conductivity; kugadzikana kwakanaka kwemakemikari; high wiring density; RoHS Certified

Cons: urombo wedunhu conductivity; high sintering tembiricha; mari inodhura

HTCC chidimbu chepamusoro-tembiricha co-fired ceramic. Ndiyo yekutanga ceramic PCB yekugadzira nzira. Zvinhu zveceramic zveHTCC ialumina, mullite, kana aluminium nitride.

Maitiro ekugadzira ayo ndeaya:

Pa1300-1600 ℃, ceramic poda (isina girazi yakawedzerwa) inopiswa uye yakaomeswa kuti iome. Kana dhizaini ichida kuburikidza nemakomba, maburi anodonhedzwa pa substrate board.

Pakupisa kwakafanana, simbi yakakwirira-inonyunguduka inonyungudutswa sesimbi. Simbi inogona kuva tungsten, molybdenum, molybdenum, manganese, zvichingodaro. Simbi inogona kuva tungsten, molybdenum, molybdenum, uye manganese. Iyo simbi paste inodhindwa maererano nedhizaini kuti iite denderedzwa redunhu pane redunhu substrate.

Tevere, 4% -8% sintering rubatsiro inowedzerwa.

Kana iyo PCB iri multilayer, maseru akaiswa laminated.

Zvadaro pa1500-1600 ℃, musanganiswa wose unoputirwa kuti ugadzire mabhodhi eceramic circuit.

Pakupedzisira, iyo solder mask inowedzerwa kuchengetedza dunhu redunhu.

Mutete Firimu Ceramic PCB Manufacturing

Pros: kuderera kwekugadzira tembiricha; fine circuit; kunaka kwepamusoro flatness

Cons: midziyo yekugadzira inodhura; haikwanise kugadzira matatu-dimensional maseketi

Iyo mhangura yemhangura pane yakaonda firimu ceramic PCBs ine makobvu madiki pane 1mm. Iyo huru ceramic zvinhu zveyakaonda-firimu ceramic PCBs ndeye alumina uye aruminiyamu nitride. Maitiro ekugadzira ayo ndeaya:

Iyo ceramic substrate inocheneswa kutanga.

Mune vacuum mamiriro, mwando paceramic substrate inoputika.

Zvadaro, mhangura yemhangura inoumbwa pamusoro peceramic substrate pamusoro nemagnetron sputtering.

Mufananidzo wedunhu unoumbwa pamhangura yemhangura neyero-chiedza photoresist tekinoroji.

Zvadaro mhangura yakawandisa inobviswa ne etching.

Pakupedzisira, iyo solder mask inowedzerwa kuchengetedza dunhu.

Pfupiso: iyo yakaonda firimu ceramic PCB kugadzira inopera mune vacuum mamiriro. Iyo yero mwenje lithography tekinoroji inobvumira kunyatsojeka kudunhu. Zvisinei, kugadzirwa kwemafirimu akaonda kune muganhu wehukobvu hwemhangura. Mutete-firimu ceramic PCBs akakodzera kurongedza-chaiyo kurongedza uye zvishandiso muhukuru diki.

DPC

Pros: hapana muganho kune ceramic mhando uye ukobvu; fine circuit; kuderera kwekushisa kwekugadzira; kunaka kwepamusoro flatness

Cons: midziyo yekugadzira inodhura

DPC ndiyo chidimbu chemhangura yakapfava yakananga. Iyo inokura kubva kune yakaonda firimu ceramic yekugadzira nzira uye inovandudza nekuwedzera kukora kwemhangura kuburikidza neplating. Maitiro ekugadzira ayo ndeaya:

Iyo yakafanana yekugadzira nzira yekugadzira yakaonda-firimu kusvikira mufananidzo wedunhu wadhindwa pafirimu yemhangura.

Iyo yedunhu mhangura ukobvu inowedzerwa neplating.

Firimu yemhangura inobviswa.

Pakupedzisira, iyo solder mask inowedzerwa kuchengetedza dunhu.

Mhedziso

Ichi chinyorwa chinonongedza yakajairika ceramic PCB kugadzira nzira. Inosuma iyo ceramic PCB yekugadzira maitiro uye inopa pfupiso ongororo yemaitiro. Kana mainjiniya / zvigadziriso makambani / masangano achida kuve nemaceramic PCB anogadzirwa uye akaunganidzwa, YMSPCB ichaunza zana inogutsa kwavari.