HDI PCB 12 Layer 2 Step HDI Board | YMS PCB
Parameters
Akaturikidzana: 12
Base Material:FR4 High Tg EM827
Ukobvu: 1.2 ± 0.1mm
Min.Hole Size:0.15mm
Minimum Line Width/Space:0.075mm/0.075mm
Minimum clearance pakati Inner Rukoko PTH uye Line: 0.2mm
Size:101mm×55mm
Kuonekwa Ratio: 8: 1
Pamusoro kurapwa: ENIG
Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole
Mafomu: Telecommunication
What is HDI PCBs?
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI pcb design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
1.Multi-danho HDI inoita kubatana pakati chero akaturikidzana;
2.Cross-rukoko Laser kubudiswa anogona kuwedzera unhu pamwero multi-danho HDI;
3.The zvaainazvo HDI uye mukuru-kakawanda zvinhu, simbi anotsanangura laminates, FPC nezvimwe inokosha laminates uye pezvakaitwa dzinoita zvinodiwa mukuru arambe achirema uye yakakwirira kakawanda, mukuru kupisa anoitisa, kana 3D gungano.
YMS HDI pcb yekugadzira capa bility:
YMS HDI pcb yekugadzira kugona kuongorora | |
Feature | kugona |
Layer Count | 4-60L |
Inowanikwa HDI PCB Technology | 1 + N + 1 |
2 + N + 2 | |
3 + N + 3 | |
4 + N + 4 | |
5 + N + 5 | |
Chero rukoko | |
Ukobvu | 0.3mm-6mm |
Minimum mutsara Hupamhi uye Nzvimbo | 0.05mm / 0.05mm (2mil / 2mil) |
BGA PITCH | 0.35mm |
Min laser Yakachera Saizi | 0.075mm (3nil) |
Min michina Yakaboorwa Saizi | 0.15mm (6mil) |
Aspect Ratio kuti Laser mugomba | 0.9: 1 |
Aspect Ratio kuburikidza nepaburi | 16: 1 |
Pamusoro Pedza | HASL, Tungamira yemahara HASL, ENIG, Kunyudza Tin, OSP, Kunyudza Sirivheri, Goridhe Munwe, Electroplating Hard Goridhe, Inosarudza OSP, ENEPIG.etc. |
Via Zadza Sarudzo | Iyo nzira inoputirwa uye izere neyakaitisa kana isiri-inoitisa epoxy yakabva yavhara uye kufukidzwa pamusoro |
Mhangura yakazadzwa, sirivheri yakazadzwa | |
Laser kuburikidza nemhangura yakavharwa yakavharwa | |
Kunyoresa | ± 4mil |
Solder Mask | Green, Tsvuku, Yero, Bhuruu, Chena, Dema, Pepuru, Matte Nhema, Matte girini.etc. |
Unogona Kuda:
1, The application range and circuit advantage of HDI board are introduced
2, PCB production skills: HDI board CAM production method
3, PCB design of 1 step, 2 step and 3step HDI
4, HDI PCB Manufacturing Process
5、Ko HDI PCBs dzinoshandiswa kupi
6. MaPCB eceramic anogadzirwa sei
Dzidza zvakawanda nezve YMS zvigadzirwa
What is HDI in PCB?
HDI Boards – High Density Interconnect
What are the layers of a PCB?
Substrate Layer.
Copper Layer.
Soldermask layer.
Silkscreen layer.
What is HDI stackup?
HDI is short for high density interconnect, and refers to the use of buried, blind and micro vias as well as any layer HDIs to create compact boards.