HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Faamatalaga puupuu:

HDI lolomi laupapa matagaluega offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

le faataamilosaga

Faaputuga: 8

Base Material:FR4 High Tg EM827

Mafiafia: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Maualalo Line lautele / Space: 0.10mm / 0.10mm

Maualalo kilia i le va Totonu Totonu PTH ma Line ： 0.2mm

Tele: 222mm × 120mm

Aspect Ratio：10.6 : 1

Luga togafitiga: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Talosaga: komepiuta

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Faamatalaga oloa

FAQ

pine o oloa

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Komiti Faatino faagasologa tuuina:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

I le atoa, e faigata le faagasologa o le tuuina atu o ipu HDI, lea e tatau ona maea ina ua mavae le tele o taimi o le tuuina atu mo se taimi umi. E le na o le manaoga sili mo le sao atoatoa ma shrinkage pulea o vaega taitasi, ae faapea foi maualuga tulaga faatonuina i le mea e faaaoga, meafaigaluega, siosiomaga ma tagata faapitoa.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB gaosiga gafatia aotelega
Faʻaaliga	agavaʻa
Faʻamaumauga	4-60L
Avanoa HDI PCB Tekonolosi	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Soʻo se vaega
Mafiafia	0.3mm-6mm
Maualalo laina lautele ma avanoa	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min leisa Viliina tele	0.075mm (3nil)
Min masini Viliina lapoa	0.15mm (6mil)
Vaega Fua Faʻatusatusa mo leisa pu	0.9: 1
Aspect Fua faʻatusatusa mo ala pu	16: 1
Luga Faʻamaeʻaina	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Filifili OSP, ENEPIG.etc.
Via Faatumu Filifiliga	O le ala e ufiufi ma faʻatumuina i le epoxy conductive poʻo le non-conductive ona faʻapipiʻi lea ma ufiufi i luga
	Ua tumu le kopa, ua tumu le ario
	Leisa e ala i apamemea plated tapunia
Lesitalaina	± 4milā
Ufimata ufimata	Lanumeamata, Mumu, Lanumoana, Lanumoana, Paʻepaʻe, Uliuli, lanu viole, Matte Uliuli, Matte lanumeamata.