China High Tg PCB Advanced PCB Manufacturing| YMS PCB factory and manufacturers | Yongmingsheng
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High Tg PCB Advanced PCB Manufacturing| YMS PCB

Kratek opis:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs. 

parametri

Layers: 4L High Tg FR4 Material

Thinkness plošče: 1,6 mm

Base Material:EM827 High tg

Najmanjše luknje: 0,2 mm

Najmanjša širina / razmik črte: 0,075 mm / 0,075 mm

Najmanjši razmik med notranjim slojem PTH do črte: 0,2 mm

Size:208mm×148mm

Razmerje: 8: 1

Surface treatment:Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics


Podrobnosti izdelka

Oznake izdelka

How do I classify high-TG materials?

material TG MOT
FR4-standard-TG 130°C 110°C
FR4-mittel-TG 150°C 130°C
FR4-hoch-TG 170°C 150°C
Polyimid-Super-hoch-TG-Material 250°C 230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance. 

You may apply the following values:

Material type Typical „TG“
CEM1 110-130°C
FR4 120-180°C
PTFE 200-260°C
Ceramic 200-300°C
Polyimide 200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview

Značilnost zmogljivosti
Število slojev 3-60L
Na voljo večplastna tehnologija PCB Skozi luknjo z razmerjem stranic 16: 1
pokopan in slep
Hibridna High Frequency Material such as RO4350B and FR4 TG 180°Mix  etc.
High Speed Material such as M7NE and FR4 TG 180°Mix   etc.
Debelina 0,3 mm-8 mm
Najmanjša širina črte in presledek 0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PITCH 0,35 mm
Min. Mehanska vrtana velikost 0,15 mm (6 mil)
Razmerje stranic skozi luknjo 16: 1
Površinska obdelava HASL, brez svinca HASL, ENIG, potopni kositer, OSP, potopno srebro, zlati prst, galvansko trdo zlato, selektivni OSP , ENEPIG.itd.
Prek možnosti polnjenja Prehod je prekrit in napolnjen s prevodnim ali neprevodnim epoksidom, nato zaprt in prekrit (VIPPO)
Napolnjen z bakrom, napolnjen s srebrom
Registracija ± 4mil
Maska za spajkanje Zelena, rdeča, rumena, modra, bela, črna, vijolična, mat črna, mat zelena itd.

Preberite več novic


https://www.ymspcb.com/4layer-high-tg-board.html



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