HDI Green Soldermask flex-rigid Board

Immersion Gold

Immersion Gold is the method of chemical deposition, through the chemical REDOX reaction to generate a layer of coating which is generally thick, is a chemical nickel gold layer deposition method, can achieve a thicker gold layer.

The process of Immersion Gold on the surface of printed circuit is characterized by stable color, good brightness, smooth coating and good weld ability. Basically, it can be divided into four stages: pre-treatment (oil removal, micro-corrosion, activation and leaching), nickel precipitation, gold precipitation, post-treatment (waste gold water washing,DI washing, drying), gold precipitation thickness between 0.025-0.1um.

Gold used in the surface treatment of circuit boards, because of its strong electrical conductivity, good oxidation resistance, long life, general applications such as keypad, gold finger board.