HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Stručný opis:

HDI dosky plošných spojov offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parametre

Vrstvy: 8

Base Material:FR4 High Tg EM827

Hrúbka: 1,6 ± 0,10 mm

Min.Hole Size：0.15mm

Minimálna šírka čiary / Space: 0,10 mm / 0,10 mm

Minimálna vzdialenosť medzi PTH vnútornej vrstvy a líniou ： 0,2 mm

Rozmery: 222 mm x 120 mm

Aspect Ratio：10.6 : 1

Povrchová úprava: Enigmu

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Použitie: Computer

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Detail produktu

FAQ

štítky produktu

HDI DPS is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

Proces výroby HDI Stravovanie:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

V celku, výrobný proces HDI dosky je komplex, ktorý musí byť dokončený po mnohých dobách produkcie na dlhú dobu. Nie je to len vysoké požiadavky na presnosť a zmrštenie kontrolu jednotlivých vrstiev, ale aj vysoké štandardy materiálov, zariadení, prostredie a technický personál.

YMS HDI PCB manufacturing capabilities:

Prehľad možností výroby DPS YMS HDI
Funkcia	schopnosti
Počet vrstiev	4-60L
Dostupná technológia HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Akákoľvek vrstva
Hrúbka	0,3 mm - 6 mm
Minimálna šírka a medzera	0,05 mm / 0,05 mm (2 míle / 2 míle)
BGA PITCH	0,35 mm
Min. Laserom vyvŕtaná veľkosť	0,075 mm (3nil)
Minimálna mechanická vŕtaná veľkosť	0,15 mm (6 mil)
Pomer strán pre laserovú dieru	0,9: 1
Pomer strán pre priechodný otvor	16: 1
Povrchová úprava	HASL, Olovo bez HASL, ENIG, Immersion Cin, OSP, Immersion Silver, Gold Finger, Galvanické tvrdé zlato, Selektívne OSP ， ENEPIG.etc.
Prostredníctvom možnosti Vyplniť	Priechodka je pokovovaná a naplnená vodivým alebo nevodivým epoxidom, potom zakrytá a pokovovaná
	Medené, strieborné
	Laser pomocou pozláteného uzáveru
Registrácia	± 4 mil
Spájkovacia maska	Zelená, červená, žltá, modrá, biela, čierna, fialová, matná čierna, matná zelená atď.