Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in پي سي بي manufacturing .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
ڇپيل سرڪٽ بورڊ تعارف
عام پرنٽ ٿيل سرڪٽ بورڊ: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
يو ايس ايم عام پي سي بي ٺاھڻ جي صلاحيتون:
| يو ايم ايس عام پي سي بي ٺاھڻ جي صلاحيت جو جائزو | ||
| خصوصيت | صلاحيتون | |
| پرت جي ڳڻپ | 1-60 ليٽر | |
| عام عام پي سي بي ٽيڪنالاجي دستياب آهي | سوراخ جي ذريعي Aspect Ratio 16: 1 | |
| دفن ٿيل ۽ انڌو ذريعي | ||
| هائبرڊ | هاءِ فريڪئنسي وارو مواد جهڙوڪ RO4350B ۽ FR4 مکڻ وغيره. | |
| تيز رفتار مواد جهڙوڪ M7NE ۽ FR4 مکڻ وغيره. | ||
| مواد | سي ايم- | CEM-1 ؛ CEM-2 ، CEM-4 ، CEM-5.etc |
| FR4 | EM827 ، 370HR ، S1000-2 ، IT180A ، IT158 ، S1000 / S1155 ، R1566W ، EM285 ، TU862HF ، NP170G وغيره. | |
| تيز رفتار | ميگٽرون 6 ، ميگاٽرون 4 ، ميگٽرون 7 ، TU872SLK ، FR408HR ، N4000-13 سيريز ، MW4000 ، MW2000 ، TU933 وغيره. | |
| هاء ات | Ro3003 ، Ro3006 ، Ro4350B ، Ro4360G2 ، Ro4835 ، CLTE ، Genclad ، RF35 ، FastRise27 وغيره. | |
| ٻيا | پاليميمائيڊ ، ٽيڪ ، ايل سي پي ، بي ٽي ، سي-پلائي ، فريادفيلڪس ، اوميگا ، ZBC2000 ، PEEK ، PTFE ، سيرامڪ تي ٻڌل وغيره. | |
| ٿولهه | 0.3mm-8mm | |
| وڌ. کاپر موٽائي | 10 او زيڊ | |
| گھٽ ۾ گھٽ لڪير جي ويڪرائي ۽ جاءِ | 0.05mm / 0.05mm (2mil / 2mil) | |
| بيگا پيچو | 0.35 ايم ايم | |
| گھٽ ميڪاني ڊريل سائيز | 0.15 ملي ميٽر (6 ميل) | |
| سوراخ جي ذريعي جيتري تناسب | 16: 1 | |
| مٿاڇري ختم | HASL ، Lead Free HASL ، ENIG ، Immersion Tin ، OSP ، Immersion Silver ، Gold Finger ، Electroplating Hard Gold ، Selective OSP ， ENEPIG.etc. | |
| في آپشن ذريعي | وچ ۾ پليو ويو آهي ۽ يا ٻيو ڪو نان ڪوليڪٽو يا غير ڪنڊيڪوٽو ايپي آڪسائيڊ سان ڀريو ويو آهي ۽ پوءِ ختم ٿي ويو ۽ چٽو ڪيو ويو (VIPPO) | |
| ٽامي ڀريل ، چاندي ڀريل | ||
| رجسٽريشن | ± 4مل | |
| سولڊر ماسڪ | سائو ، ڳاڙھو ، پيلو ، نيرو ، اڇو ، ڪارو ، جامني ، مٽي ڪارو ، مٽي سائو وغيره. | |
توهان پسند ڪري سگھي ٿو:
1، گهيرو بورڊ ويلڊنگ ۾ ڌيان جي ضرورت معاملن جو خلاصو
5. اعلي تعدد پي سي بي ڊيزائن ڇا آهي
و Learnيڪ سکو YMS پروڊڪٽس بابت
