HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

لنډ معلومات:

د HDI چاپ شوي سرکټ بورډونه offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

پارامترونو

طبقو: 8

Base Material:FR4 High Tg EM827

ضخامت 1.6 ± 0.10mm

Min.Hole Size：0.15mm

لږ تر لږه د ليکې سور / فضا: 0.10mm / 0.10mm

د داخلي پرت PTH او لاین ： 0.2mm ترمنځ لږترلږه تصفیه

کچه: 222mm × 120mm

Aspect Ratio：10.6 : 1

سطحي درملنه: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

غوښتنلیکونه: کمپيوتر

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د محصول د تفصیلي

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د محصول د نښانونه

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI بورډ د تولید په پروسه:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

په ټوله کې، د HDI ذریعه د تولید په پروسه پیچلې ده، چې باید وروسته د اوږدې مودې لپاره د تولید د څو ځلې بشپړ شي. دا د هر طبقه د سموالي او انقباض کنترول لوړ اړتیاو، خو هم د موادو، تجهیزاتو، چاپیریال او تخنیکي پرسونل لوړ معیارونه نه یواځې.

YMS HDI PCB manufacturing capabilities:

د YMS HDI PCB تولید ظرفیتونو کتنه
بatureه	وړتیاوې
د پوړ شمیره	4-60L
د HDI PCB ټیکنالوژي شتون لري	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	هره طبقه
ضخامت	0.3 ملي - 6 ملي میتر
لږترلږه د لیکې عرض او فضا	0.05mm / 0.05mm (2 ملی / 2 ملی)
د BGA پیټ	0.35 ملي میتر
د ماین لیزر ډرل شوي اندازه	0.075 ملي میتر (3nil)
د ماین میخانیکي ډرل شوي اندازه	0.15 ملی میتره (6 ملی)
د لیزر سوري لپاره د اړخ تناسب	0.9: 1
د سوري له لارې د تناسب تناسب	16: 1
سطح پای	HASL ، مخکښ وړ HASL ، ENIG ، د ژغورنې ټین ، OSP ، د ژور چاندی ، د طلا ګوتې ، د سختو زرو سره الیکټروپلیټ کول ، انتخابي OSP ， ENEPIG.etc.
د ډکولو اختیار له لارې	له لارې پلاتیدل کیږي او یا هم د وړونکي یا غیر conductive epoxy سره ډک شوي بیا پوښل شوي او له مینځه وړل کیږي
	کاپر ډک شوی ، د سپینو زرو ډک شوی
	لیزر د مسو پلیټ بند له لارې
ثبتول	m 4mil
د سپک ماسک	شنه ، سور ، ژیړ ، نیلي ، سپین ، تور ، ارغواني ، فلټ تور ، میټ سبز.ټیک.