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Professional Factory for China FPC/FPCA, FPCBA, flexible PCB, flex PCB, rigid-flex PCB/HDI flex PCB/FPC, PCB/flex PCB laminating service

Short Description:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias. 

Parameters

Layers: 12L HDI any-layer  pcb

Board Thinkness:1.6mm

Base Material:FR4 High Tg S1170

Min Holes:0.2mm

Minimum Line Width/Clearance:0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line: 0.2mm

Size:981mm×65mm

Aspect Ratio:10 : 1

Surface treatment:ENIG

Speciality: Any layer hdi pcb, Laser via copper plated shut

Differential impedance 100+7/-8Ω

Applications:Communication


Product Detail

Product Tags

We insist on offering high-quality creation with superior business enterprise concept, honest revenue plus the greatest and fast service. it will bring you not only the high quality solution and huge profit, but essentially the most significant is usually to occupy the endless market for Professional Factory for China FPC/FPCA, FPCBA, flexible PCB, flex PCB, rigid-flex PCB/HDI flex PCB/FPC, PCB/flex PCB laminating service, We sincerely welcome overseas customers to consult for the long-term cooperation and the mutual development.We strongly believe that we can do better and better.
We insist on offering high-quality creation with superior business enterprise concept, honest revenue plus the greatest and fast service. it will bring you not only the high quality solution and huge profit, but essentially the most significant is usually to occupy the endless market for China Rigid-flexibile FPC/FPCA, flexible-rigid FPCA/FPC, We always insist on the management tenet of “Quality is first, Technology is basis, Honesty and Innovation”.We’ve been able to develop new items continuously to a higher level to satisfy different needs of customers.

What is HDI PCB?

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It’s relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

all via type

Advantages of HDI PCB

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

YMS HDI PCB manufacturing capabilities:

hdi pcb any layer hdi pcb high speed hard gold plating for edge connectors  gold fingers insertion loss test enepig 5+N+5+stackup

YMS HDI PCB manufacturing capabilities overview
Feature capabilities
Layer Count 4-60L
Available HDI PCB Technology 1+N+1
2+N+2
3+N+3
4+N+4
5+N+5
Any layer
Thickness 0.3mm-6mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA PITCH 0.35mm
Min laser Drilled Size 0.075mm(3nil)
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for laser hole 0.9:1
Aspect Ratio for through hole 16:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
Copper filled, silver filled
Laser via copper plated shut
Registration ±4mil
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. 

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