| Technical index | Mass Batch | Small batch | Sample | ||
| Base Material | FR4 | Normal Tg | Shengyi S1141、KB6160、Huazhen H140（not suitable for lead free process ） | ||
| Middle Tg | For HDI、multi layers： SY S1000H、ITEQIT158、HuazhengH150; TU-662； | ||||
| High Tg | For thick copper、high layer：SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA：FR408R; 370HR； TU-752； | ||||
| Halogen Free | Middle Tg ：SY S1150G、HuazhengH150HF、H160HF；high Tg: SY S1165 | ||||
| High CTI | CTI≥600 SY S1600、Huazheng H1600HF、H1600A； | ||||
| High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 | ||||
| High Speed | SY S7439；TU-862HF、TU-872SLK；ISOLA:I-Speed、I-Tera@MT40；Huazheng：H175、H180、H380 | ||||
| Flex Material | Base | Glue-free：Dupont AK XingyangW-type, Panosonic RF-775； | |||
| Coverlay | SY SF305C、Xingyang Q-type | ||||
| Special PP | No flow PP：VT-447LF，Taiguang 370BL Arlon 49N | ||||
| Ceramic filled adhesive sheet:Rogers4450F | |||||
| PTFE adhesive sheet:Arlon6700、Taconic FR-27/FR-28 | |||||
| Double-sided coatingPI:xingyang N-1010TF-mb | |||||
| Metal Base | Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase | ||||
| Special | High heat resistance rigidity PI： Tenghui VT-901、Arlon 85N，SY S260（Tg250） | ||||
| High thermal conductivity material：92ML | |||||
| Pure ceramic material：alumina ceramic、Aluminum nitride ceramics | |||||
| BT material：Taiwan Nanya NGP-200WT | |||||
| Layers | FR4 | 36 | 60 | 140 | |
| Rigid&Flex /（Flex） | 16（6） | 16（6） | 24（6） | ||
| High Frequency Mixed Lamination | 12 | 12 | 20 | ||
| 100% PTFE | 6 | 6 | 10 | ||
| HDI | 2 steps | 3 steps | 4 steps | ||
| Technical Index | Mass Batch | Small Batch | Sample | ||
| Delivery Size | Max(mm) | 460*560 | 460*560 | 550*900 | |
| (mm) | Min(mm) | 20*20 | 10*10 | 5*10 | |
| Width / Gap | Inner（mil） | 0.5OZ base copper： 3/3 1.0OZ base copper： 4/4 2.0OZ base copper： 5/6 | |||
| 3.0OZ base copper： 7/9 4.0OZ base copper： 8/12 5.0OZ base copper： 10/15 | |||||
| 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 12 OZ base copper： 20/28 | |||||
| Outer（mil） | 1/3OZ base copper： 3/3 0.5OZ base copper： 4/4 1.0OZ base copper： 5/5 | ||||
| 2.0OZ base copper： 6/8 3.0OZ base copper： 7/10 4.0OZ base copper： 8/13 | |||||
| 5.0OZ base copper： 10/16 6.0OZ base copper： 12/18 10 OZ base copper： 18/24 | |||||
| 12 OZ base copper： 20/28 15 OZ base copper： 24/32 | |||||
| Line Width Tolerance | ＞5.0 mil | ±20% | ±20% | ±1.0mil | |
| ≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | ||
| Drilling | Min laser （mm） | 0.1 | 0.1 | 0.1 | |
| Min CNC（mm） | 0.2 | 0.15 | 0.15 | ||
| Max CNC drill bit（mm） | 6.5 | 6.5 | 6.5 | ||
| Min Half Hole(mm) | 0.5 | 0.4 | 0.4 | ||
| PTH Hole (mm) | Normal | ±0.1 | ±0.075 | ±0.075 | |
| Pressing Hole | ±0.05 | ±0.05 | ±0.05 | ||
| Hole Angle (conical) | Width of upper diameter≤6.5mm：800、900、1000、1100；Width of upper diameter≥6.5mm：900； | ||||
| Precision of Depth-control Drilling（mm） | ±0.10 | ±0.075 | ±0.05 | ||
| Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | ||
| Minimum via hole spacing (different network, military, medical, automobile )mm | 0.5 | 0.45 | 0.4 | ||
| Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm | 0.4 | 0.35 | 0.3 | ||
| Technical index | Mass batch | Small batch | sample | ||
| Drilling | The minimum hole wall spacing of the over hole (the same network mm) | 0.2 | 0.2 | 0.15 | |
| Minimum hole wall spacing (mm) for device holes | 0.8 | 0.7 | 0.7 | ||
| The minimum distance from via hole to the inner copper or line | 0.2 | 0.18 | ≤10L: 0.15 | ||
| >10L: 0.18 | |||||
| The min distance from Device hole to inner copper or line | 0.3 | 0.27 | 0.25 | ||
| Welding Ring | Via hole | 4（HDI 3mil） | 3.5（HDI 3mil） | 3 | |
| (mil) | Component hole | 8 | 6 | 6 | |
| Solder Dam (mil) | （solder mask） | 5 | 4 | 4 | |
| （hybrid） | 6 | 5 | 5 | ||
| Final Board Thickness | ＞1.0 mm | ±10% | ±8% | ±8% | |
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | ||
| Board thickness（mm） | 0.5-5.0 | 0.4-6.5 | 0.3-11.5 | ||
| Board thickness/drill bit | 10:01:00 | 12:01:00 | 13:01:00 | ||
| Via hole（drill bit）plug hole（plug solder ） | 0.25-0.5mm | 0.20-0.5mm | 0.15-0.6mm | ||
| Blind buried hole, hole inside pad | 0.25-0.5mm | 0.20-0.5mm | 0.10-0.6mm | ||
| Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% | ||
| Impedance Control | ≥5.0mil | ±10% | ±10% | ±8% | |
| <5.0mil | ±10% | ±10% | ±10% | ||
| CNC | contour tolerance（mm） | ±0.15 | ±0.10 | ±0.10 | |
| V-CUT Tolerance of residual thickness(mm) | ±0.15 | ±0.10 | ±0.10 | ||
| Routing slot（mm） | ±0.15 | ±0.10 | ±0.10 | ||
| Precision of controlled deep milling（mm） | ±0.15 | ±0.10 | ±0.10 | ||
| Technical index | Mass batch | Small batch | sample | ||
| Contour | Bevel edge | 20～60 degree；±5degree | |||
| Surface Treatments | Immersion gold | Ni thickness(micro inch) | 118-236 | 118-236 | 118-236 |
| Max gold (uinch) | 3 | 3 | 6 | ||
| Hard gold(Au thick) | Gold finger(uinch) | 15 | 30 | 60 | |
| NiPdAu | NI(uinch) | 118-236 | |||
| PA(uinch) | 2-5 | ||||
| Au(uinch) | 1-5 | ||||
| Graph electric gold | NI(uinch) | 120-400 | |||
| AU(uinch) | 1-3 | ||||
| Immersion tin | Tin(um) | 0.8-1.2 | |||
| Immersion Ag | Ag(uinch) | 6-10 | |||
| OSP | thick(um) | 0.2-0.5 | |||
| HAL/HAL LF | BGApad(mm) | ≥0.3×0.3 | |||
| thickness（mm） | 0.6≤H≤3.0 | ||||
| Board thickness vs hole diameter | Press hole≤3:1 | ||||
| Tin（um） | 2.0-40.0 | ||||
| Rigid & Flex | Maximum dielectric thickness of flex | Glue –free 25um | Glue-free 75um | Glue-free75um | |
| Flex part width(mm) | ≥10 | ≥5 | ≥5 | ||
| Max delivery size (mm) | 200×400 | 200×500 | 400 ×550 | ||
| distance of via hole to edge of Rigid&flex(mm) | ≥1.2 | ≥1.0 | ≥0.8 | ||
| (mm)distance of components hole to the edge of R&F | ≥1.5 | ≥1.2 | ≥1.0 | ||
| Technical index | Mass batch | Small batch | sample | ||
| Rigid & Flex | Structure | The outer layer structure of the flex part, the PI reinforcement structure and the separation structure | Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film | ||
| Special Tech | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination | Buried magnetic core PCB | Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB | ||
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