Original Factory Layer Rigid-Flex Circuit Prototype - 10Layer 2 Step HDI Board | YMS PCB – Yongmingsheng
Original Factory Layer Rigid-Flex Circuit Prototype - 10Layer 2 Step HDI Board | YMS PCB – Yongmingsheng Detail:
HDI Structures:
1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers.
i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.
Any Layer HDI – All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures (“any layer via”). This provides a reliable interconnect solution for highly complex large pin-count device
Product detail pictures:
Related Product Guide:
Global HDI Market 2019 – Unimicron, Compeq, AT&S, SEMCO, Ibiden, TTM, ZDT, Tripod, DAP | Fingerprint Lock Rigid-Flexible Pcb
Hdi Microvia Pcb Market 2019 Types, Applications, Production, Consumption, Sales, Imports/Exports, Size & Share Forecast to 2024 | Rigid-Flexible Pcb
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