OEM/ODM Supplier Ultra-Thin Flexible Pcb - OEM Factory for Electronic Oem Bare Printed Circuit Board Manufacturing Small Volume Pcb Assembly – Yongmingsheng

Dependable high-quality and fantastic credit standing are our principles, which will help us at a top-ranking position. Adhering to your tenet of “quality very first, client supreme” for OEM Factory for Electronic Oem Bare Printed Circuit Board Manufacturing Small Volume Pcb Assembly, Our merchandise have exported to North America, Europe, Japan, Korea, Australia, New Zealand, Russia and other countries. On the lookout ahead to create up a fantastic and long lasting cooperation along with you in coming foreseeable future!
Dependable high-quality and fantastic credit standing are our principles, which will help us at a top-ranking position. Adhering to your tenet of “quality very first, client supreme” for Bare Pcb Manufacturing, Pcb Board, Small Volume Pcb Assembly, Our mission is to deliver consistently superior value to our customers and their clients. This commitment permeates everything we do, driving us to continuously develop and improve our products and the processes to fulfill your needs.
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.

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1、The application range and circuit advantage of HDI board are introduced

2、PCB production skills: HDI board CAM production method

3、PCB design of 1 step, 2 step and 3step HDI