OEM Supply Fr-4 Pcb - HDI Printed Circuit Board 8Layer 2 Step HDI PCB| YMSPCB – Yongmingsheng

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We have a professional, efficiency team to provide quality service for our customer. We always follow the tenet of customer-oriented, details-focused for Small Printed Circuit Board, Electriplating Filling Pcb, Printed Circuit Board, We are sincerely looking forward to cooperate with customers all over the world. We believe we can satisfy you. We also warmly welcome customers to visit our company and purchase our products.

OEM Supply Fr-4 Pcb - HDI Printed Circuit Board 8Layer 2 Step HDI PCB| YMSPCB – Yongmingsheng Detail:

HDI Board production process:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

On the whole, the production process of HDI plate is complex, which needs to be completed after many times of production for a long time. It’s not only high requirements for the accuracy and shrinkage control of each layer, but also high standards in materials, equipment, environment and technical personnel.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	4-60L
Available HDI PCB Technology	1+N+1
	2+N+2
	3+N+3
	4+N+4
	5+N+5
	Any layer
Thickness	0.3mm-6mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min laser Drilled Size	0.075mm(3nil)
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for laser hole	0.9:1
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
	Copper filled, silver filled
	Laser via copper plated shut
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

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We've been convinced that with joint efforts, the enterprise between us will bring us mutual benefits. We are able to assure you product or service quality and aggressive cost for OEM Supply Fr-4 Pcb - HDI Printed Circuit Board 8Layer 2 Step HDI PCB| YMSPCB – Yongmingsheng , The product will supply to all over the world, such as: Kyrgyzstan, Marseille, Hanover, We focus on providing service for our clients as a key element in strengthening our long-term relationships. Our continual availability of high grade products in combination with our excellent pre-sale and after-sales service ensures strong competitiveness in an increasingly globalized market. We are willing to cooperate with business friends from at home and abroad and create a great future together.

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The factory workers have rich industry knowledge and operational experience, we learned a lot in working with them,we are extremely grateful that we can encount a good company has excellent wokers.