Magawo ophatikizika amagawo atchuka kwambiri posachedwa. Zakhalapo chifukwa cha kutuluka kwa mitundu yophatikizika yozungulira monga chip-scale package (CSP) ndi gululi ya mpira phukusi (BGP). Maphukusi otere a IC amayitanitsa zonyamula zatsopano, zomwe zimawerengedwa ndi gawo lapansi la IC. Monga wopanga zamagetsi kapena mainjiniya, sizikutsimikiziranso zokwanira kumvetsetsa kufunikira kwa gawo lapansi la phukusi la IC. Muyenera kumvetsetsa njira yopangira gawo la IC, gawo lomwe ma IC amathandizira pakugwira ntchito moyenera kwa zamagetsi, ndi madera ogwiritsira ntchito. IC substrate ndi mtundu wa board yoyambira yomwe imagwiritsidwa ntchito kuyika chip chopanda IC (integrate circuit) chip. Kulumikiza chip ndi board board, IC ndi ya chinthu chapakatikati chokhala ndi izi:

• imagwira semiconductor IC chip;

• pali mayendedwe mkati kulumikiza Chip ndi PCB;

• Imatha kuteteza, kulimbikitsa ndi kuthandizira IC chip, kupereka ngalande yakutha kwa kutentha.

Makhalidwe a IC Substrate

Magawo ophatikizika amakhala ndi zinthu zambiri komanso zosiyanasiyana. Zimaphatikizapo zotsatirazi.

Kuwala pankhani ya kulemera

Mawaya amtovu ochepa ndi zolumikizira zolumikizirana

Odalirika kwambiri

Kuchita bwino pamene zina monga kudalirika, kulimba, ndi kulemera kwake ziphatikizidwa

Kukula kwakung'ono Kodi kuwombeza kwa gawo la IC la PCB ndi chiyani?

IC substrate ndi mtundu wa board yoyambira yomwe imagwiritsidwa ntchito kuyika chip chopanda IC (integrate circuit) chip. Kulumikiza chip ndi board board, IC ndi ya chinthu chapakatikati chokhala ndi izi:

• imagwira semiconductor IC chip;

• pali mayendedwe mkati kulumikiza Chip ndi PCB;

• Imatha kuteteza, kulimbikitsa ndi kuthandizira IC chip, kupereka ngalande yakutha kwa kutentha. 

Kugwiritsa ntchito kwa IC Substrate PCB

Ma PCB a IC gawo lapansi amagwiritsidwa ntchito kwambiri pazinthu zamagetsi zopepuka, zowonda komanso zotsogola, monga mafoni anzeru, laputopu, PC yam'mapiritsi ndi maukonde pazolumikizana ndi matelefoni, chithandizo chamankhwala, kuwongolera mafakitale, zakuthambo ndi zankhondo.

Ma PCB okhwima atsatira njira zingapo zaluso kuchokera ku multilayer PCB, ma PCB achikhalidwe a HDI, SLP (ngati PCB yapansi panthaka) mpaka ma PCB apakati a IC. SLP ndi mtundu chabe wa ma PCB olimba omwe ali ndi njira yopangira yofananira pafupifupi semiconductor sikelo.

Kuyang'anira Kuthekera ndi Kudalirika Kwaukadaulo Woyeserera

IC substrate PCB imayitanitsa zida zoyendera zomwe ndizosiyana ndi zomwe zimagwiritsidwa ntchito pa PCB yachikhalidwe. Kuphatikiza apo, mainjiniya ayenera kukhalapo omwe amatha kudziwa luso lowunika pazida zapadera.

Zonsezi, IC substrate PCB imafuna zofunikira zambiri kuposa zomwe opanga ma PCB ndi PCB ayenera kukhala ndi luso lapamwamba lopanga ndikukhala odziwa bwino. Monga wopanga yemwe ali ndi zaka zambiri zakuchitikira kwa PCB komanso zida zapamwamba zopangira, YMS ikhoza kukhala bwenzi loyenera mukayendetsa projekiti ya PCB. Pambuyo popereka mafayilo onse omwe amafunikira kupanga, mutha kupeza ma prototype board anu pakatha sabata kapena kuchepera. Chonde titumizireni kuti tipeze mtengo wabwino kwambiri komanso nthawi yopanga.