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High Tg PCB Advanced PCB Manufacturing| YMS PCB

Kort beskrivelse:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs. 

parametere

Layers: 4L High Tg FR4 Material

Board Thinkness: 1,6 mm

Base Material:EM827 High tg

Min. Hull: 0,2 mm

Minimum linjebredde / klaring : 0,075 mm / 0,075 mm

Minimumsavstand mellom indre lag PTH til linje : 0,2 mm

Size:208mm×148mm

Sideforhold: 8: 1

Surface treatment:Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics


Produkt detalj

produkt~~POS=TRUNC

How do I classify high-TG materials?

Materiale TG MOT
FR4-standard-TG 130°C 110°C
FR4-mittel-TG 150°C 130°C
FR4-hoch-TG 170°C 150°C
Polyimid-Super-hoch-TG-Material 250°C 230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance. 

You may apply the following values:

Material type Typical „TG“
CEM1 110-130°C
FR4 120-180°C
PTFE 200-260°C
Ceramic 200-300°C
Polyimide 200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview

Trekk evner
Lagtelling 3-60L
Tilgjengelig flerlags PCB-teknologi Gjennomgående hull med bildeforhold 16: 1
gravlagt og blind via
Hybrid High Frequency Material such as RO4350B and FR4 TG 180°Mix  etc.
High Speed Material such as M7NE and FR4 TG 180°Mix   etc.
Tykkelse 0,3 mm-8 mm
Minimum linjebredde og mellomrom 0,05mm / 0,05mm (2mil / 2mil)
BGA PITCH 0,35 mm
Min mekanisk boret størrelse 0,15 mm (6mil)
Bildeforhold for gjennomgående hull 16: 1
Overflatebehandling HASL, Blyfri HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP , ENEPIG.etc.
Via Fill-alternativet Via er belagt og fylt med enten ledende eller ikke-ledende epoksy, deretter dekket og belagt over (VIPPO)
Kobberfylt, sølvfylt
Registrering ± 4mil
Loddemaske Grønn, Rød, Gul, Blå, Hvit, Svart, Lilla, Matt Svart, Matt Grønn. Osv.

Les flere nyheter


https://www.ymspcb.com/4layer-high-tg-board.html



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