HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Korte beschrijving:

HDI-printplaten offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parameters

Lagen: 8

Base Material:FR4 High Tg EM827

Dikte: 1,6 ± 0,10 mm

Min.Hole Size：0.15mm

Minimumlijnbreedte / Space: 0.10mm / 0.10mm

Minimale afstand tussen binnenste laag PTH en lijn: 0,2 mm

Grootte: 222mm x 120mm

Aspect Ratio：10.6 : 1

Oppervlaktebehandeling: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Toepassingen: Computer

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Product detail

FAQ

product Tags

HDI-PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board productieproces:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Over het geheel genomen, het productieproces van HDI plaat is complex, dat moet na vele malen van de productie voor een lange tijd te worden afgerond. Het is niet alleen hoge eisen aan de nauwkeurigheid en krimp controle van elke laag, maar ook hoge normen op materialen, apparatuur, milieu en technisch personeel.

YMS HDI PCB manufacturing capabilities:

Overzicht YMS HDI PCB-productiemogelijkheden
Voorzien zijn van	mogelijkheden
Aantal lagen	4-60L
Beschikbare HDI PCB-technologie	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Elke laag
Dikte	0,3 mm - 6 mm
Minimale lijnbreedte en spatie	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PLAATS	0,35 mm
Min. Laser geboorde maat	0,075 mm (3 nul)
Min mechanisch geboorde maat	0,15 mm (6 mil)
Aspect Ratio voor lasergat	0,9: 1
Aspect Ratio voor doorlopend gat	16: 1
Oppervlakteafwerking	HASL, loodvrij HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG. Enz.
Via vuloptie	De via is geplateerd en gevuld met geleidende of niet-geleidende epoxy en vervolgens afgedekt en geplateerd
	Koper gevuld, zilver gevuld
	Laser via verkoperde sluiting
Registratie	± 4mil
Soldeer masker	Groen, rood, geel, blauw, wit, zwart, paars, matzwart, matgroen. Enz.