High Tg material PCB 6 Layer High Tg Board| YMS PCB

Korte beschrijving:

High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG PCB fabrikant , look no further. You can use YMS technology to design your high TG PCB boards.

parameters

Layers: 6L High Tg FR4 Material Board Thinkness: 1,6 mm Base Material:EM827 High tg Min gaten: 0,2 mm Minimale lijnbreedte / speling: 0,075 mm / 0,075 mm Minimale afstand tussen binnenste laag PTH tot lijn: 0,2 mm Size：214mm×148mm Aspect Ratio: 8: 1 Oppervlaktebehandeling: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Voorzien zijn van	mogelijkheden
Aantal lagen	3-60L
Beschikbare meerlagige PCB-technologie	Doorgaand gat met beeldverhouding 16: 1
	begraven en blind via
	Hybride	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Dikte	0,3 mm-8 mm
Minimale lijnbreedte en spatie	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PLAATS	0,35 mm
Min mechanisch geboorde maat	0,15 mm (6 mil)
Aspect Ratio voor doorlopend gat	16: 1
Oppervlakteafwerking	HASL, loodvrij HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG. Enz.
Via vuloptie	De via is geplateerd en gevuld met geleidende of niet-geleidende epoxy en vervolgens afgedekt en bedekt (VIPPO)
	Koper gevuld, zilver gevuld
Registratie	± 4mil
Soldeer masker	Groen, rood, geel, blauw, wit, zwart, paars, matzwart, matgroen. Enz.